Diamond cantilevers for MEMS sensor applications fabricated by laser ablation and optimized etching techniques

Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68378271%3A_____%2F22%3A00564978" target="_blank" >RIV/68378271:_____/22:00564978 - isvavai.cz</a>
Result on the web
<a href="http://dx.doi.org/10.1109/ASDAM55965.2022.9966776" target="_blank" >http://dx.doi.org/10.1109/ASDAM55965.2022.9966776</a>
DOI - Digital Object Identifier
<a href="http://dx.doi.org/10.1109/ASDAM55965.2022.9966776" target="_blank" >10.1109/ASDAM55965.2022.9966776</a>

Result language
angličtina
Original language name
Diamond cantilevers for MEMS sensor applications fabricated by laser ablation and optimized etching techniques
Original language description
The properties of diamond make it an attractive material for MEMS and sensor devices. We present the feasibility to fabricate membranes and cantilevers made of nano-(micro-) crystalline diamond films grown on Si/SiO2 substrates using microwave chemical vapour deposition (MWCVD). The patterning of micromechanical structures was performed by a combined process of femtosecond laser ablation and wet etching. We designed cantilever structures with varying lengths and widths (25, 50, 100, 200 and 300 µm). The cantilevers were made in a symmetric left- and right-hand configuration. An additional laser treatment was used to modify the mechanical properties of the left-hand cantilever. The deflection of the laser-treated, and non-treated sections was measured. The global mechanical system properties were simulated and corresponded with high accuracy to the measured results of deflection.
Czech name
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Czech description
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Project
<a href="/en/project/8X20035" target="_blank" >8X20035: Advanced Microcantilevers from Wide Bandgap Materials</a><br>
Continuities
I - Institucionalni podpora na dlouhodoby koncepcni rozvoj vyzkumne organizace

Publication year
2022
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Article name in the collection
Proceedings of the 14th International Conference on Advanced Semiconductor Devices And Microsystems
ISBN
978-1-6654-6977-7
ISSN
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e-ISSN
—
Number of pages
4
Pages from-to
195-198
Publisher name
IEEE
Place of publication
New York
Event location
Smolenice
Event date
Oct 23, 2022
Type of event by nationality
WRD - Celosvětová akce
UT code for WoS article
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