Qualification of 1030 nm ultra-short-pulsed laser for glass sheet treatment in TGV process

Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68378271%3A_____%2F22%3A00568504" target="_blank" >RIV/68378271:_____/22:00568504 - isvavai.cz</a>
Result on the web
<a href="https://www.spiedigitallibrary.org/conference-proceedings-of-spie/11988/2610143/Qualification-of-1030-nm-ultra-short-pulsed-laser-for-glass/10.1117/12.2610143.short?SSO=1" target="_blank" >https://www.spiedigitallibrary.org/conference-proceedings-of-spie/11988/2610143/Qualification-of-1030-nm-ultra-short-pulsed-laser-for-glass/10.1117/12.2610143.short?SSO=1</a>
DOI - Digital Object Identifier
<a href="http://dx.doi.org/10.1117/12.2610143" target="_blank" >10.1117/12.2610143</a>

Result language
angličtina
Original language name
Qualification of 1030 nm ultra-short-pulsed laser for glass sheet treatment in TGV process
Original language description
Glass sheets with ~ 0.1 mm thickness are a promising material from which interposers for high density chip packaging can be produced due to its electrical and mechanical properties. For successful application in microelectronics, it is necessary to develop a way of efficient, high-speed production of interconnecting holes through such glass substrate, socalled through glass vias (TGVs). One of the most promising technique is Laser-Induced Deep Etching (LIDE), where picosecond laser is used to modified particular areas on the glass substrate. Then, using wet etching process, the area exposed to the laser will be etched more quickly than unexposed area. However, effective and large-scale glass modification often requires use of high-energy pulsed UV laser source, which unnecessary complicates the whole application. Here we present effective preparation of treated glass substrate using Yb:YAG laser at its fundamental wavelength 1030 nm, which is capable to overcome such disadvantage.
Czech name
—
Czech description
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Project
Result was created during the realization of more than one project. More information in the Projects tab.
Continuities
P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)

Publication year
2022
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Article name in the collection
Laser Applications in Microelectronic and Optoelectronic Manufacturing (LAMOM) XXVII
ISBN
978-1-5106-4848-7
ISSN
0277-786X
e-ISSN
—
Number of pages
12
Pages from-to
1198804
Publisher name
SPIE
Place of publication
Bellingham
Event location
San Francisco
Event date
Jan 22, 2022
Type of event by nationality
WRD - Celosvětová akce
UT code for WoS article
000844454100003

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