Vapour Soldering System with Peltier Heater
The result's identifiers
Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21220%2F09%3A00157590" target="_blank" >RIV/68407700:21220/09:00157590 - isvavai.cz</a>
Result on the web
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DOI - Digital Object Identifier
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Alternative languages
Result language
angličtina
Original language name
Vapour Soldering System with Peltier Heater
Original language description
A system using peltier heater is provided for vapour phase soldering of components on PCB, system with increasing heating and cooling speed of the components and PCB lands that are to be soldered together. Vapour phase soldering (VPS) uses the latent heat of liquid vaporization to provide heat for soldering. This latent heat is released as the vapour of the inert liquid condenses on components and PCB lands. The peak soldering temperature is the boiling temperature of the inert liquid at atmospheric pressure.
Czech name
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Czech description
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Classification
Type
D - Article in proceedings
CEP classification
JA - Electronics and optoelectronics
OECD FORD branch
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Result continuities
Project
<a href="/en/project/1M0568" target="_blank" >1M0568: Josef Božek Research Center of Engine and Automotive Technology II</a><br>
Continuities
P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)
Others
Publication year
2009
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů
Data specific for result type
Article name in the collection
Applied Electronics 2009
ISBN
978-80-7043-781-0
ISSN
1803-7232
e-ISSN
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Number of pages
4
Pages from-to
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Publisher name
Západočeská univerzita v Plzni
Place of publication
Plzeň
Event location
Plzeň
Event date
Sep 9, 2009
Type of event by nationality
EUR - Evropská akce
UT code for WoS article
000273977300018