Vapor Phase Soldering Device and Checking Solder Joints
The result's identifiers
Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21220%2F12%3A00194414" target="_blank" >RIV/68407700:21220/12:00194414 - isvavai.cz</a>
Result on the web
—
DOI - Digital Object Identifier
—
Alternative languages
Result language
angličtina
Original language name
Vapor Phase Soldering Device and Checking Solder Joints
Original language description
Soldering has become the major and conventional method in the electronic assembling industry for joining electronic components. The industry is seeking for the use of environment friendly lead-free solders. A system is provided for vapor phase solderingof components and printed circuit board, system controls increasing speed and cooling speed temperature of the components and PCB lands that are to be soldered together. There are many methods of checking solder joints. For complex analysis I used the method of destructive checking by cutting through the solder joint with a diamond cutting machine and then performing measurements and finally taking pictures with the aid of the microscope.
Czech name
—
Czech description
—
Classification
Type
D - Article in proceedings
CEP classification
JA - Electronics and optoelectronics
OECD FORD branch
—
Result continuities
Project
—
Continuities
S - Specificky vyzkum na vysokych skolach
Others
Publication year
2012
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů
Data specific for result type
Article name in the collection
Proceedings of the 10th International Conference Process Control 2012
ISBN
9788073955007
ISSN
—
e-ISSN
—
Number of pages
9
Pages from-to
"C040c-1"-"C040c-9"
Publisher name
Univerzita Pardubice, Chemicko-technologická fakulta
Place of publication
Pardubice
Event location
Kouty nad Desnou
Event date
Jun 12, 2012
Type of event by nationality
EUR - Evropská akce
UT code for WoS article
—