Temperature distribution during the phase change in the volume of the solder alloy

Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F16%3A00306821" target="_blank" >RIV/68407700:21230/16:00306821 - isvavai.cz</a>
Result on the web
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DOI - Digital Object Identifier
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Result language
angličtina
Original language name
Temperature distribution during the phase change in the volume of the solder alloy
Original language description
Solder is usually an alloy of two and more metals. Very often is used tin, lead, copper, silver, bismuth, nickel, etc. for its production. If the alloy is exposed to a sufficiently high temperature, it is induced phase change from solid to liquid phase for it. Phase is changed again from liquid to solid during cooling substance. At this point, the substance generates a latent heat that is manifests differently for each alloy. Each component contributes its thermal and conductivity parameters into the overall properties of the alloy. The result determines quantity of the generated latent heat. And by final amount of the temperature acts on their surroundings. There have been several experimental measurements for determining of decomposition of temperature in a volume of electrically conductive solder joints during a phase change (from liquid to solidstate). Measurements were carried out on the reference alloy Sn-Pb (eutectic) and three lead-free solder alloys.
Czech name
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Czech description
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Publication year
2016
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Article name in the collection
Proceedings of the International Spring Seminar on Electronics Technology
ISBN
978-1-5090-1389-0
ISSN
2161-2536
e-ISSN
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Number of pages
4
Pages from-to
222-225
Publisher name
IEEE Press
Place of publication
New York
Event location
Plzeň
Event date
May 18, 2016
Type of event by nationality
WRD - Celosvětová akce
UT code for WoS article
000387089800044

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