Occurrence of Voids in Soldered Joints for Electrical Engineering
The result's identifiers
Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21220%2F24%3A00378838" target="_blank" >RIV/68407700:21220/24:00378838 - isvavai.cz</a>
Alternative codes found
RIV/68407700:21230/24:00378838
Result on the web
<a href="https://doi.org/10.1109/ISSE61612.2024.10603930" target="_blank" >https://doi.org/10.1109/ISSE61612.2024.10603930</a>
DOI - Digital Object Identifier
<a href="http://dx.doi.org/10.1109/ISSE61612.2024.10603930" target="_blank" >10.1109/ISSE61612.2024.10603930</a>
Alternative languages
Result language
angličtina
Original language name
Occurrence of Voids in Soldered Joints for Electrical Engineering
Original language description
The research focuses on the occurrence of voids in soldered joints in the field of electrical engineering. The main goal was to analyze the occurrence of voids in soldered joints and to propose effective strategies to minimize this defect. BGA chips mounted on 10-layer PCBs were chosen as test samples. The current work focuses on defining production conditions and analyzing X-ray images. The analysis results implies that the parameters were chosen correctly and the acceptability criteria according to the ECSS-Q-ST-70-61C standard (defining soldering qualification for the space industry) were met with a margin, allowing for further types of tests such as vibration test and temperature cycling.
Czech name
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Czech description
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Classification
Type
D - Article in proceedings
CEP classification
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OECD FORD branch
20201 - Electrical and electronic engineering
Result continuities
Project
—
Continuities
I - Institucionalni podpora na dlouhodoby koncepcni rozvoj vyzkumne organizace
Others
Publication year
2024
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů
Data specific for result type
Article name in the collection
2024 47th International Spring Seminar on Electronics Technology (ISSE)
ISBN
979-8-3503-8548-9
ISSN
2161-2536
e-ISSN
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Number of pages
5
Pages from-to
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Publisher name
IEEE Press
Place of publication
New York
Event location
Praha
Event date
May 15, 2024
Type of event by nationality
WRD - Celosvětová akce
UT code for WoS article
001283808200050