Study of Influence of Working Conditions on Changes of the Surface Tension of a Solders
The result's identifiers
Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F06%3A00123702" target="_blank" >RIV/68407700:21230/06:00123702 - isvavai.cz</a>
Result on the web
—
DOI - Digital Object Identifier
—
Alternative languages
Result language
angličtina
Original language name
Study of Influence of Working Conditions on Changes of the Surface Tension of a Solders
Original language description
Two types of solders, SnPb and SAC, have been investigated from the point of view of a surface tension. Different conditions, such as the solder temperature, contents of oxygen and type of surface have been applied, wettability of the solder has been measured.
Czech name
—
Czech description
—
Classification
Type
D - Article in proceedings
CEP classification
JA - Electronics and optoelectronics
OECD FORD branch
—
Result continuities
Project
—
Continuities
Z - Vyzkumny zamer (s odkazem do CEZ)
Others
Publication year
2006
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů
Data specific for result type
Article name in the collection
SIITME 2006 - International Symposium for Design and Technology of Electronic Packaging
ISBN
978-973-8961-23-4
ISSN
—
e-ISSN
—
Number of pages
5
Pages from-to
—
Publisher name
Technical University
Place of publication
Iasi
Event location
Iasi
Event date
Sep 21, 2006
Type of event by nationality
WRD - Celosvětová akce
UT code for WoS article
—