Influence of Reflow Temperature Profile on Properties of Soldered Joints

Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F09%3A00162950" target="_blank" >RIV/68407700:21230/09:00162950 - isvavai.cz</a>
Result on the web
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DOI - Digital Object Identifier
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Result language
angličtina
Original language name
Influence of Reflow Temperature Profile on Properties of Soldered Joints
Original language description
This article presents results of research aimed at the influence of manufacturing process of electronic device on creation and growth of intermetallic layers in the solder. These layers can significantly influence performance and reliability of the entire electronic device. Exact beahvior of intermetallic compounds under various conditions is not yet fully known - that is also one of the reasons sensitive devices for aerospace, medical or military industries are allowed to still use solders containing lead - and it is important to gain such knowledge, before the leadfree solders are allowed into such applications. To further this goal, this research compared both experimentally and theoretically various situations, that may be encountered during the electronic devices production.
Czech name
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Czech description
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Publication year
2009
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Article name in the collection
Electronic Devices and Systems, IMAPS CS International Conference 2009 Proceedings
ISBN
978-80-214-3933-7
ISSN
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e-ISSN
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Number of pages
6
Pages from-to
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Publisher name
VUT v Brně, FEI
Place of publication
Brno
Event location
Brno
Event date
Sep 2, 2009
Type of event by nationality
EUR - Evropská akce
UT code for WoS article
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