Image analysis of lead free solders
The result's identifiers
Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F11%3A00181751" target="_blank" >RIV/68407700:21230/11:00181751 - isvavai.cz</a>
Result on the web
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DOI - Digital Object Identifier
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Alternative languages
Result language
angličtina
Original language name
Image analysis of lead free solders
Original language description
Article deals with actual problem of lead free soldering and solves issue of image analysis of lead free solders and soldering process. For image analysis was used special software - NIS elements. In concrete article deals with image analysis of spread factor, observation of creation and growth of tin whiskers from surface finishes, analysis of manufacturing technologies (vapor soldering, hot air soldering) of soldered joints, cross sections of soldered and adhesive joints etc.
Czech name
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Czech description
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Classification
Type
O - Miscellaneous
CEP classification
JA - Electronics and optoelectronics
OECD FORD branch
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Result continuities
Project
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Continuities
S - Specificky vyzkum na vysokych skolach
Others
Publication year
2011
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů