Comparison of Dynamic and Static Mechanical Stress Applied on Soldered Joints
The result's identifiers
Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F10%3A00171625" target="_blank" >RIV/68407700:21230/10:00171625 - isvavai.cz</a>
Result on the web
<a href="http://ieeexplore.ieee.org/search/srchabstract.jsp?tp=&arnumber=5547292&queryText%3Dcomparison+of+dynamic+and+static%26openedRef" target="_blank" >http://ieeexplore.ieee.org/search/srchabstract.jsp?tp=&arnumber=5547292&queryText%3Dcomparison+of+dynamic+and+static%26openedRef</a>
DOI - Digital Object Identifier
<a href="http://dx.doi.org/10.1109/ISSE.2010.5547292" target="_blank" >10.1109/ISSE.2010.5547292</a>
Alternative languages
Result language
angličtina
Original language name
Comparison of Dynamic and Static Mechanical Stress Applied on Soldered Joints
Original language description
This article deals with the mechanical stress of lead and lead free soldered joints. During usage of electrical equipment are found structural changes of soldered joints, which can lead to cracks or failure of the solder joints. In this article, the changes of the electrical resistance of dynamic and static stressed soldered joints (lead Sn62Pb36Ag2 and lead free Sn95,5Ag4Cu0,5) are compared.
Czech name
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Czech description
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Classification
Type
D - Article in proceedings
CEP classification
JA - Electronics and optoelectronics
OECD FORD branch
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Result continuities
Project
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Continuities
Z - Vyzkumny zamer (s odkazem do CEZ)
Others
Publication year
2010
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů
Data specific for result type
Article name in the collection
33rd International Spring Seminar on Electronics Technology
ISBN
978-1-4244-7849-1
ISSN
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e-ISSN
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Number of pages
4
Pages from-to
204-207
Publisher name
IEEE
Place of publication
New York
Event location
Warsaw
Event date
May 12, 2010
Type of event by nationality
WRD - Celosvětová akce
UT code for WoS article
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