Influence of Mechanical Stress and Temperature Aging on a Change of Electrical Connection Resistance
The result's identifiers
Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F08%3A00147969" target="_blank" >RIV/68407700:21230/08:00147969 - isvavai.cz</a>
Result on the web
—
DOI - Digital Object Identifier
—
Alternative languages
Result language
angličtina
Original language name
Influence of Mechanical Stress and Temperature Aging on a Change of Electrical Connection Resistance
Original language description
Article deals with the mechanical stress and the temperature aging of the lead and lead free soldered joints. Mechanical stress and temperature aging can change electrical properties of the soldered joints, e.g. electrical resistance. In this article, the changes of the electrical resistance of mechanically stressed and temperature aged soldered joints (lead Sn62Pb36Ag2 and lead free Sn95.5Ag4Cu0.5) are compared.
Czech name
—
Czech description
—
Classification
Type
D - Article in proceedings
CEP classification
JA - Electronics and optoelectronics
OECD FORD branch
—
Result continuities
Project
—
Continuities
Z - Vyzkumny zamer (s odkazem do CEZ)
Others
Publication year
2008
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů
Data specific for result type
Article name in the collection
31st International Spring Seminar on Electronics Technology
ISBN
978-1-4244-3973-7
ISSN
—
e-ISSN
—
Number of pages
4
Pages from-to
—
Publisher name
IEEE
Place of publication
New York
Event location
Budapest
Event date
May 7, 2008
Type of event by nationality
WRD - Celosvětová akce
UT code for WoS article
000272337900010