The Conductive Adhesive Joins under Thermal Shock

Result code in IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F11%3A00183836" target="_blank" >RIV/68407700:21230/11:00183836 - isvavai.cz</a>

Result on the web

—

DOI - Digital Object Identifier

—

Result language

angličtina

Original language name

The Conductive Adhesive Joins under Thermal Shock

Original language description

The work is focused on joins realised by electrically conductive adhesives. Lower curing temperature is main advantage of adhesives. But electrical and mechanical parameters are worse than for solders. The influence of thermal shocks on properties of joins realized by electrically conductive adhesives were analyzed. The temperature during thermal ageing is changed from room temperature to temperature below freezing point. Electrical resistance and non-linearity of current voltage characteristic were measured. Mechanical strength was measured too.

Czech name

—

Czech description

—

Type

D - Article in proceedings

CEP classification

JA - Electronics and optoelectronics

OECD FORD branch

—

Project

—

Continuities

Z - Vyzkumny zamer (s odkazem do CEZ)

Publication year

2011

Confidentiality

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Article name in the collection

NANOCON 2011 Conference Proceedings

ISBN

978-80-87294-23-9

ISSN

—

e-ISSN

—

Number of pages

1

Pages from-to

108

Publisher name

TANGER, spol.s r.o.

Place of publication

Ostrava

Event location

Brno

Event date

Sep 21, 2011

Type of event by nationality

EUR - Evropská akce

UT code for WoS article

—