Influence of Surface Finish on Resistance of Contacts between ECA and Pad
The result's identifiers
Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F11%3A00184692" target="_blank" >RIV/68407700:21230/11:00184692 - isvavai.cz</a>
Result on the web
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DOI - Digital Object Identifier
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Alternative languages
Result language
angličtina
Original language name
Influence of Surface Finish on Resistance of Contacts between ECA and Pad
Original language description
Contact resistance between adhesive and pad is examined. Three types of adhesives based on bis-phenol epoxy resin matrix filled with silver flakes are studied on copper, nickel and gold surface finishes. The contact resistance is calculated and difference between contact resistances is measured. Resistances of copper and gold finishes are the lowest.
Czech name
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Czech description
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Classification
Type
D - Article in proceedings
CEP classification
JA - Electronics and optoelectronics
OECD FORD branch
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Result continuities
Project
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Continuities
Z - Vyzkumny zamer (s odkazem do CEZ)
Others
Publication year
2011
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů
Data specific for result type
Article name in the collection
34th International Spring Seminar on Electronics Technology
ISBN
978-1-4577-2111-3
ISSN
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e-ISSN
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Number of pages
2
Pages from-to
170-171
Publisher name
Technical University of Košice
Place of publication
Košice
Event location
Tatranská Lomnica
Event date
May 11, 2011
Type of event by nationality
WRD - Celosvětová akce
UT code for WoS article
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