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Influence of Surface Finish on Resistance of Contacts between ECA and Pad

The result's identifiers

  • Result code in IS VaVaI

    <a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F11%3A00184692" target="_blank" >RIV/68407700:21230/11:00184692 - isvavai.cz</a>

  • Result on the web

  • DOI - Digital Object Identifier

Alternative languages

  • Result language

    angličtina

  • Original language name

    Influence of Surface Finish on Resistance of Contacts between ECA and Pad

  • Original language description

    Contact resistance between adhesive and pad is examined. Three types of adhesives based on bis-phenol epoxy resin matrix filled with silver flakes are studied on copper, nickel and gold surface finishes. The contact resistance is calculated and difference between contact resistances is measured. Resistances of copper and gold finishes are the lowest.

  • Czech name

  • Czech description

Classification

  • Type

    D - Article in proceedings

  • CEP classification

    JA - Electronics and optoelectronics

  • OECD FORD branch

Result continuities

  • Project

  • Continuities

    Z - Vyzkumny zamer (s odkazem do CEZ)

Others

  • Publication year

    2011

  • Confidentiality

    S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Data specific for result type

  • Article name in the collection

    34th International Spring Seminar on Electronics Technology

  • ISBN

    978-1-4577-2111-3

  • ISSN

  • e-ISSN

  • Number of pages

    2

  • Pages from-to

    170-171

  • Publisher name

    Technical University of Košice

  • Place of publication

    Košice

  • Event location

    Tatranská Lomnica

  • Event date

    May 11, 2011

  • Type of event by nationality

    WRD - Celosvětová akce

  • UT code for WoS article