All

What are you looking for?

All
Projects
Results
Organizations

Quick search

  • Projects supported by TA ČR
  • Excellent projects
  • Projects with the highest public support
  • Current projects

Smart search

  • That is how I find a specific +word
  • That is how I leave the -word out of the results
  • “That is how I can find the whole phrase”

3D Modeling of Assembly Influence on Packaged Transistors

The result's identifiers

  • Result code in IS VaVaI

    <a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F11%3A00185041" target="_blank" >RIV/68407700:21230/11:00185041 - isvavai.cz</a>

  • Result on the web

    <a href="http://www.arftg.org" target="_blank" >http://www.arftg.org</a>

  • DOI - Digital Object Identifier

Alternative languages

  • Result language

    angličtina

  • Original language name

    3D Modeling of Assembly Influence on Packaged Transistors

  • Original language description

    Detailed analysis of 70-mil package and wafer scale package (WSP) based on the 3D field simulations is presented. It is shown that an assembly plays significant role in the package behavior. Simulation results confirm that the parameters of the package are varying with the change of the assembly-substrate parameters. The approach potentially makes possible to transfer parameters of a transistor corresponding to certain assembly to another assembly without necessity of new measurements. It is very promising in the design of amplifiers namely power amplifiers (PA).

  • Czech name

  • Czech description

Classification

  • Type

    D - Article in proceedings

  • CEP classification

    JA - Electronics and optoelectronics

  • OECD FORD branch

Result continuities

  • Project

  • Continuities

    Z - Vyzkumny zamer (s odkazem do CEZ)

Others

  • Publication year

    2011

  • Confidentiality

    S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Data specific for result type

  • Article name in the collection

    78th ARFTG Microwave Measurement Conference Proceedings

  • ISBN

    978-1-4673-0281-4

  • ISSN

  • e-ISSN

  • Number of pages

    6

  • Pages from-to

    24-29

  • Publisher name

    IEEE Microwave Theory and Techniques Society, US

  • Place of publication

    Piscataway

  • Event location

    Tempe

  • Event date

    Nov 29, 2011

  • Type of event by nationality

    WRD - Celosvětová akce

  • UT code for WoS article