3D Modeling of Assembly Influence on Packaged Transistors
The result's identifiers
Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F11%3A00184396" target="_blank" >RIV/68407700:21230/11:00184396 - isvavai.cz</a>
Result on the web
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DOI - Digital Object Identifier
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Alternative languages
Result language
angličtina
Original language name
3D Modeling of Assembly Influence on Packaged Transistors
Original language description
Achievements and work in progress from year 2011 are shown and discussed in this paper. This research is examining an assembly influences on packaged microwave transistors. Complex 3D electromagnetic simulations software is used to characterize the effects. Packages that were simulated are: Excelics 70-mil package and Avago Wafer Scale Package (WSP) which is used for the current VMMK transistor/amplifier range. Packages' dimensions were accurately measured and modeled accordingly. The assembly influencewill be discussed while using four different substrates and two transmission lines. The effect of different surrounding environment for transistor package will be shown in the frequency range up to 40 GHz. The simulation results are verified by the measurements as well and good match is obtained.
Czech name
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Czech description
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Classification
Type
D - Article in proceedings
CEP classification
JA - Electronics and optoelectronics
OECD FORD branch
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Result continuities
Project
<a href="/en/project/GD102%2F08%2FH027" target="_blank" >GD102/08/H027: Advanced Methods, Structures and Components of Electronic Wireless Communication</a><br>
Continuities
P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)
Others
Publication year
2011
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů
Data specific for result type
Article name in the collection
Sborník semináře o řešení doktorského projektu Grantové agentury České republiky č. 102/08/H027 v roce 2011 - Pokročilé metody, struktury a komponenty elektronické bezdrátové komunikace
ISBN
978-80-214-4368-6
ISSN
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e-ISSN
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Number of pages
5
Pages from-to
26-30
Publisher name
VUT v Brně, FEKT, Ústav radioelektroniky
Place of publication
Brno
Event location
Brno
Event date
Nov 22, 2011
Type of event by nationality
CST - Celostátní akce
UT code for WoS article
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