Influence of Humidity on Voids Formation Inside the Solder Joint
The result's identifiers
Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F12%3A00200415" target="_blank" >RIV/68407700:21230/12:00200415 - isvavai.cz</a>
Alternative codes found
RIV/68407700:21230/13:00213097
Result on the web
<a href="http://dms.fzu.cz/22/printables/absbook.pdf" target="_blank" >http://dms.fzu.cz/22/printables/absbook.pdf</a>
DOI - Digital Object Identifier
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Alternative languages
Result language
angličtina
Original language name
Influence of Humidity on Voids Formation Inside the Solder Joint
Original language description
Article deals with influence of humidity on voids formation inside the solder joint. Experimental part was carried on testing samples, where we used three types of solder pastes (Sn62Pb36Ag2, Sn96.5Ag3Cu0.5 and Sn95.5Ag4Cu0.5), three types of reflow technology (hot air, vapor phase and infra radiation) and three types of humidity environments. PCB together with SMD resistors, were placed in three different types of humidity environments (dry - humidity was less than 5%, ambient - average humidity was around 60 % and humid environment - 100 % humidity) for 500 hours. After that we took the components from environments and we prepared samples - the solder paste was applied on the solder pads using a screen printing process, components were placed on PCBand then the solder paste was reflowed. The inspection was made on X-Ray and following diagnostic was made by image analysis with special software. We evaluate the number of voids together with their total area of all voids inside each so
Czech name
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Czech description
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Classification
Type
O - Miscellaneous
CEP classification
JA - Electronics and optoelectronics
OECD FORD branch
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Result continuities
Project
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Continuities
S - Specificky vyzkum na vysokych skolach
Others
Publication year
2013
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů