Study of the components self-alignment in surface mount technology
The result's identifiers
Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F00216208%3A11320%2F12%3A10129397" target="_blank" >RIV/00216208:11320/12:10129397 - isvavai.cz</a>
Result on the web
<a href="http://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=6273138" target="_blank" >http://ieeexplore.ieee.org/xpl/articleDetails.jsp?arnumber=6273138</a>
DOI - Digital Object Identifier
<a href="http://dx.doi.org/10.1109/ISSE.2012.6273138" target="_blank" >10.1109/ISSE.2012.6273138</a>
Alternative languages
Result language
angličtina
Original language name
Study of the components self-alignment in surface mount technology
Original language description
The operator or pick and place machine sometimes place the component on its position with a small shift. It isn't a critical mistake, because it is a well known phenomenon that during the time when the solder paste is in liquid state the wetting force that acts on components shifts the component to the correct (straight) position according to the soldering pads. This article deals with study of SMD components self-alignment in surface mount technology. In this article, the component self-alignment withregard to different types of solders, different types of reflow technology, different solder paste volume and different component placement angles was observed. In our experiments three types of solders - one leaded (Sn62/Pb36/Ag2) and two lead-free (Sn99,25/Cu0,7/Ni0,05 and Sn95,5/Ag4/Cu0,5) and two types of reflow technologies (hot air soldering and vapor phase soldering) were used.
Czech name
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Czech description
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Classification
Type
J<sub>x</sub> - Unclassified - Peer-reviewed scientific article (Jimp, Jsc and Jost)
CEP classification
BM - Solid-state physics and magnetism
OECD FORD branch
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Result continuities
Project
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Continuities
Z - Vyzkumny zamer (s odkazem do CEZ)<br>I - Institucionalni podpora na dlouhodoby koncepcni rozvoj vyzkumne organizace
Others
Publication year
2012
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů
Data specific for result type
Name of the periodical
IEEE Xplore - 2012 35th International Spring Seminar on Electronics Technology (ISSE)
ISSN
2161-2528
e-ISSN
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Volume of the periodical
Neuveden
Issue of the periodical within the volume
srpen
Country of publishing house
AT - AUSTRIA
Number of pages
4
Pages from-to
197-200
UT code for WoS article
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EID of the result in the Scopus database
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