Study of the components self-alignment in surface mount technology
The result's identifiers
Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F12%3A00199211" target="_blank" >RIV/68407700:21230/12:00199211 - isvavai.cz</a>
Result on the web
<a href="http://dx.doi.org/10.1109/ISSE.2012.6273138" target="_blank" >http://dx.doi.org/10.1109/ISSE.2012.6273138</a>
DOI - Digital Object Identifier
<a href="http://dx.doi.org/10.1109/ISSE.2012.6273138" target="_blank" >10.1109/ISSE.2012.6273138</a>
Alternative languages
Result language
angličtina
Original language name
Study of the components self-alignment in surface mount technology
Original language description
This article deals with study of SMD components self-alignment in surface mount technology. In this article, the component self-alignment with regard to different types of solders, different types of reflow technology, different solder paste volume and different component placement angles was observed.
Czech name
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Czech description
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Classification
Type
D - Article in proceedings
CEP classification
JA - Electronics and optoelectronics
OECD FORD branch
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Result continuities
Project
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Continuities
S - Specificky vyzkum na vysokych skolach
Others
Publication year
2012
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů
Data specific for result type
Article name in the collection
35th International Spring Seminar on Electronics Technology
ISBN
978-1-4673-2241-6
ISSN
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e-ISSN
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Number of pages
4
Pages from-to
197-200
Publisher name
Technische Universität
Place of publication
Wien
Event location
Bad Aussee
Event date
May 9, 2012
Type of event by nationality
WRD - Celosvětová akce
UT code for WoS article
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