Influence of type of reflow technology and type of surface finish on tomb stone effect

Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F13%3A00210817" target="_blank" >RIV/68407700:21230/13:00210817 - isvavai.cz</a>
Result on the web
<a href="http://dx.doi.org/10.1109/ISSE.2013.6648229" target="_blank" >http://dx.doi.org/10.1109/ISSE.2013.6648229</a>
DOI - Digital Object Identifier
<a href="http://dx.doi.org/10.1109/ISSE.2013.6648229" target="_blank" >10.1109/ISSE.2013.6648229</a>

Result language
angličtina
Original language name
Influence of type of reflow technology and type of surface finish on tomb stone effect
Original language description
Surface mount technology has many problems during production. One of them is a problem called tombstone effect. Tombstone effect is a well known phenomenon, when one end of the component (commonly small passive devices such as resistor or capacitor), rises up out of the solder pad and breaks conductive contact. This article focus on the problem with tombstone effect, in concrete in this article we studied the influence of type of reflow technology and type of surface finish on tomb stone effect. In ourexperiments three types of reflow technologies, three sizes of SMD components, one type of solder paste and three types of surface finishes were used.
Czech name
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Czech description
—

Publication year
2013
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

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