Methods of Accelerated Growth of Tin Whiskers
The result's identifiers
Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F12%3A00204810" target="_blank" >RIV/68407700:21230/12:00204810 - isvavai.cz</a>
Result on the web
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DOI - Digital Object Identifier
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Alternative languages
Result language
angličtina
Original language name
Methods of Accelerated Growth of Tin Whiskers
Original language description
Unalloyed tin electroplating has a long history of whisker formation that has resulted in present reliability risks for electronic equipment. Tin whiskers can grow between adjacent conductors of different potential, causing transient or permanent electrical shorts. In addition, the whiskers can break loose, causing mechanical damage in slip rings, optical components or MEMS. The objective of our work is to investigate methods for tin whisker growth, which can further enable measuring the effectiveness of mitigation strategies.
Czech name
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Czech description
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Classification
Type
O - Miscellaneous
CEP classification
JA - Electronics and optoelectronics
OECD FORD branch
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Result continuities
Project
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Continuities
S - Specificky vyzkum na vysokych skolach
Others
Publication year
2012
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů