Modelling of Creep Behaviour During Thermal Cycling Test of Led Board for SSL Lamp

Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F13%3A00206298" target="_blank" >RIV/68407700:21230/13:00206298 - isvavai.cz</a>
Result on the web
<a href="http://www.imaps.cz/eds/" target="_blank" >http://www.imaps.cz/eds/</a>
DOI - Digital Object Identifier
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Result language
angličtina
Original language name
Modelling of Creep Behaviour During Thermal Cycling Test of Led Board for SSL Lamp
Original language description
This work presents a precious thermo-mechanical simulation and characterization of designed LED board used for retrofit solid state lightening (SSL) lamp. Work focuses on a determination of a thermo-mechanical behavior during thermal cycling tests performed in a test chamber. Because of high thermal cycling range (-20...125 °C) precious creep including elastic-plastic analysis has to be done. In the first step a transient thermo-mechanical simulation of detailed LED board model was done. Critical partsof the structure from reliability point of view were found. The second part of work aims to predict the lifetime of LED board for SSL lamp exposed to thermal cycling tests done in a thermal chamber with the specified temperature profile.
Czech name
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Czech description
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Publication year
2013
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Article name in the collection
Proceedings - Electronic Devices and Systems - EDS '13
ISBN
9788021447547
ISSN
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e-ISSN
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Number of pages
6
Pages from-to
5-10
Publisher name
Vysoké učení technické v Brně, Fakulta elektrotechniky a komunikačních technologií
Place of publication
Brno
Event location
Brno
Event date
Jun 26, 2013
Type of event by nationality
EUR - Evropská akce
UT code for WoS article
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