Design for reliability of solid state lighting systems
The result's identifiers
Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F12%3A00195116" target="_blank" >RIV/68407700:21230/12:00195116 - isvavai.cz</a>
Result on the web
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DOI - Digital Object Identifier
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Alternative languages
Result language
angličtina
Original language name
Design for reliability of solid state lighting systems
Original language description
This work presents a methodology to design an SSL system for reliability. An LED lamp is thermally characterised and its model thermally simulated, indicating that the LED board (FR4 board with thermal vias, copper tracks and LED package) is the thermally most stressed part. Therefore, a thermo-mechanical analysis is performed from a detailed LED board model to study reliability and lifetime limits, using thermal boundary conditions deduced from the thermal simulation of the whole LED lamp. Based on this analysis the weakest spots are identified as the metal vias in the LED package and the interconnection area between the LED package and copper tracks on the FR4 board.
Czech name
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Czech description
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Classification
Type
J<sub>x</sub> - Unclassified - Peer-reviewed scientific article (Jimp, Jsc and Jost)
CEP classification
JA - Electronics and optoelectronics
OECD FORD branch
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Result continuities
Project
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Continuities
R - Projekt Ramcoveho programu EK
Others
Publication year
2012
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů
Data specific for result type
Name of the periodical
Microelectronics Reliability
ISSN
0026-2714
e-ISSN
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Volume of the periodical
9-10
Issue of the periodical within the volume
52
Country of publishing house
NL - THE KINGDOM OF THE NETHERLANDS
Number of pages
7
Pages from-to
2294-2300
UT code for WoS article
000309785400106
EID of the result in the Scopus database
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