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Thermal resistance investigations on new leadframe-based LED packages and boards

The result's identifiers

  • Result code in IS VaVaI

    <a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F13%3A00205483" target="_blank" >RIV/68407700:21230/13:00205483 - isvavai.cz</a>

  • Result on the web

    <a href="http://dx.doi.org/10.1016/j.microrel.2013.02.016" target="_blank" >http://dx.doi.org/10.1016/j.microrel.2013.02.016</a>

  • DOI - Digital Object Identifier

    <a href="http://dx.doi.org/10.1016/j.microrel.2013.02.016" target="_blank" >10.1016/j.microrel.2013.02.016</a>

Alternative languages

  • Result language

    angličtina

  • Original language name

    Thermal resistance investigations on new leadframe-based LED packages and boards

  • Original language description

    In Solid State Lighting, thermal management is a key issue. Within the CSSL consortium, we have developed an advanced leadframe based LED package to reduce the thermal resistance of the component. Numerical simulations have been implemented using Ansys software and thermal measurements have been carried out using the forward voltage method to derive the thermal resistance. The T3ster transient thermal analysis has been used to determine the different thermal resistance contributions in the package and in the board, showing good correlation between experimental and simulation results. As a result, low thermal resistances of 5.5 K/W have been obtained on our advanced leadframe based LED package and have been compared with the standard configuration of multiple Rebel LEDs on FR4 board.

  • Czech name

  • Czech description

Classification

  • Type

    J<sub>x</sub> - Unclassified - Peer-reviewed scientific article (Jimp, Jsc and Jost)

  • CEP classification

    JA - Electronics and optoelectronics

  • OECD FORD branch

Result continuities

  • Project

    <a href="/en/project/7H10017" target="_blank" >7H10017: Consumerizing Solid State Lighting</a><br>

  • Continuities

    P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)

Others

  • Publication year

    2013

  • Confidentiality

    S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Data specific for result type

  • Name of the periodical

    Microelectronics Reliability

  • ISSN

    0026-2714

  • e-ISSN

  • Volume of the periodical

    8

  • Issue of the periodical within the volume

    53

  • Country of publishing house

    NL - THE KINGDOM OF THE NETHERLANDS

  • Number of pages

    11

  • Pages from-to

    1084-1094

  • UT code for WoS article

    000322292100006

  • EID of the result in the Scopus database