Thermal Resistance Investigations on New Leadframe-Based LED Packages and Boards

Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F12%3A00195948" target="_blank" >RIV/68407700:21230/12:00195948 - isvavai.cz</a>
Result on the web
<a href="http://www.eurosime.org" target="_blank" >http://www.eurosime.org</a>
DOI - Digital Object Identifier
<a href="http://dx.doi.org/10.1109/ESimE.2012.6191750" target="_blank" >10.1109/ESimE.2012.6191750</a>

Result language
angličtina
Original language name
Thermal Resistance Investigations on New Leadframe-Based LED Packages and Boards
Original language description
In Solid State Lighting, thermal management is a key issue. Within the C-SSL consortium, we have developed an advanced leadframe based package to reduce the thermal resistance of the component. Numerical simulations have been implemented using Ansys software and thermal measurements have been carried out using the forward voltage method to derive the thermal resistance. The T3ster? transient thermal analysis has been used to determine the different thermal resistance contributions in the package and inthe board showing good correlation between experimental and simulation results. Low thermal resistances of 5.5 K/W have been obtained on our advanced leadframe based package and have been compared with standard Rebel LEDs on board
Czech name
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Czech description
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Publication year
2012
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Article name in the collection
EuroSimE 2012 - Proceedings of the conference www.eurosime.org
ISBN
978-1-4673-1511-1
ISSN
—
e-ISSN
—
Number of pages
4
Pages from-to
1-4
Publisher name
IEEE
Place of publication
Porto
Event location
Lisbon
Event date
Apr 15, 2012
Type of event by nationality
WRD - Celosvětová akce
UT code for WoS article
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