Determination of BGA solder joint detachment cause - warpage effect
The result's identifiers
Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F15%3A00233831" target="_blank" >RIV/68407700:21230/15:00233831 - isvavai.cz</a>
Alternative codes found
RIV/68407700:21220/15:00233831
Result on the web
<a href="http://dx.doi.org/10.1109/ISSE.2015.7248011" target="_blank" >http://dx.doi.org/10.1109/ISSE.2015.7248011</a>
DOI - Digital Object Identifier
<a href="http://dx.doi.org/10.1109/ISSE.2015.7248011" target="_blank" >10.1109/ISSE.2015.7248011</a>
Alternative languages
Result language
angličtina
Original language name
Determination of BGA solder joint detachment cause - warpage effect
Original language description
Many aspects such as different materials used during the electronic assembly, increasingly finer dimensions of components, different processes and their settings have an influence on reliability of electronics products. This article deals with BGA assembly, specifically the determination of BGA solder joint detachment cause - with a warpage effect. Samples for diagnostic were obtained from manufacturer, who already pointed to the probable problematic location (BGA component) by electric in-circuit test.Cross-section of BGA assembly was made and an open joint - thin longitudinal gap between BGA component and solder joints connection was observed. The task was to identify a cause that produced axial detachment of BGA solder ball from component pads. Theuse of Scanning Electron Microscopy (SEM) determined that detachment was caused by a warpage effect.
Czech name
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Czech description
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Classification
Type
D - Article in proceedings
CEP classification
JA - Electronics and optoelectronics
OECD FORD branch
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Result continuities
Project
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Continuities
S - Specificky vyzkum na vysokych skolach
Others
Publication year
2015
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů
Data specific for result type
Article name in the collection
38th International Spring Seminar on Electronics Technology (ISSE 2015)
ISBN
978-1-4799-8860-0
ISSN
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e-ISSN
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Number of pages
4
Pages from-to
306-309
Publisher name
Institute of Electrical and Electronics Engineers
Place of publication
New York
Event location
Eger
Event date
May 6, 2015
Type of event by nationality
WRD - Celosvětová akce
UT code for WoS article
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