Substrate influence on temperature distribution along the PCB during vapor phase soldering
The result's identifiers
Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F16%3A00303500" target="_blank" >RIV/68407700:21230/16:00303500 - isvavai.cz</a>
Result on the web
<a href="http://80.ieeexplore.ieee.org.dialog.cvut.cz/document/7563203/" target="_blank" >http://80.ieeexplore.ieee.org.dialog.cvut.cz/document/7563203/</a>
DOI - Digital Object Identifier
<a href="http://dx.doi.org/10.1109/ISSE.2016.7563203" target="_blank" >10.1109/ISSE.2016.7563203</a>
Alternative languages
Result language
angličtina
Original language name
Substrate influence on temperature distribution along the PCB during vapor phase soldering
Original language description
This article is focused on measurement of temperature gradients in different locations on test-boards during Vapor Phase Soldering (VPS) with different materials as PCB substrates. VPS is usually applied in electronics assembly technologies due to its ability to heat the board fast and uniformly during reflow soldering. The heating rate differs significantly even on a moderate size PCB. The measurements were performed on different substrates, particularly on FR4, FR4 with aluminum core, ceramic, and polyimide flexible board samples. The temperature gradients were uniform with low heat capacity boards, contrary, the high heat capacity aluminum based PCB showed significant non-uniformity in heating, where observed temperature differences reached up to 20 °C.
Czech name
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Czech description
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Classification
Type
D - Article in proceedings
CEP classification
JA - Electronics and optoelectronics
OECD FORD branch
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Result continuities
Project
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Continuities
V - Vyzkumna aktivita podporovana z jinych verejnych zdroju
Others
Publication year
2016
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů
Data specific for result type
Article name in the collection
Proceedings of the International Spring Seminar on Electronics Technology
ISBN
978-1-5090-1389-0
ISSN
2161-2528
e-ISSN
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Number of pages
6
Pages from-to
267-272
Publisher name
IEEE Press
Place of publication
New York
Event location
Plzeň
Event date
May 18, 2016
Type of event by nationality
WRD - Celosvětová akce
UT code for WoS article
000387089800054