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Investigations on heat transfer with different PCB substrates during Vapour Phase Soldering

The result's identifiers

  • Result code in IS VaVaI

    <a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F16%3A00306417" target="_blank" >RIV/68407700:21230/16:00306417 - isvavai.cz</a>

  • Result on the web

    <a href="http://ieeexplore.ieee.org/stamp/stamp.jsp?arnumber=7777241" target="_blank" >http://ieeexplore.ieee.org/stamp/stamp.jsp?arnumber=7777241</a>

  • DOI - Digital Object Identifier

    <a href="http://dx.doi.org/10.1109/SIITME.2016.7777241" target="_blank" >10.1109/SIITME.2016.7777241</a>

Alternative languages

  • Result language

    angličtina

  • Original language name

    Investigations on heat transfer with different PCB substrates during Vapour Phase Soldering

  • Original language description

    The purpose of this article is to present our experiments with Vapour Phase Soldering, where the temperature distribution and heat transfer mechanisms were investigated on four test-boards with different substrates. We developed a method to measure the temperature gradients on- board inside an experimental vapour phase soldering oven. VP soldering process is suitable for consistent and rapid heating on boards from small scale to large ones with power components showing considerable thermal capacities. The measurements were performed on FR4, ceramic, alumina composite and flexible substrates, where the results show significant differences between the different materials, and point to investigations with thermal diffusivity for future research.

  • Czech name

  • Czech description

Classification

  • Type

    D - Article in proceedings

  • CEP classification

    JA - Electronics and optoelectronics

  • OECD FORD branch

Result continuities

  • Project

  • Continuities

    V - Vyzkumna aktivita podporovana z jinych verejnych zdroju

Others

  • Publication year

    2016

  • Confidentiality

    S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Data specific for result type

  • Article name in the collection

    2016 IEEE 22nd International Symposium for Design and Technology in Electronic Packaging (SIITME)

  • ISBN

    978-1-5090-4446-7

  • ISSN

  • e-ISSN

  • Number of pages

    7

  • Pages from-to

    48-54

  • Publisher name

    IEEE

  • Place of publication

    New York

  • Event location

    Oradea

  • Event date

    Oct 20, 2016

  • Type of event by nationality

    WRD - Celosvětová akce

  • UT code for WoS article

    000390557400006