Investigating the effect of solder paste viscosity change on the pressure during stencil printing
The result's identifiers
Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F16%3A00306420" target="_blank" >RIV/68407700:21230/16:00306420 - isvavai.cz</a>
Result on the web
<a href="http://ieeexplore.ieee.org/document/7777238/#full-text-section" target="_blank" >http://ieeexplore.ieee.org/document/7777238/#full-text-section</a>
DOI - Digital Object Identifier
<a href="http://dx.doi.org/10.1109/SIITME.2016.7777238" target="_blank" >10.1109/SIITME.2016.7777238</a>
Alternative languages
Result language
angličtina
Original language name
Investigating the effect of solder paste viscosity change on the pressure during stencil printing
Original language description
The purpose of this article is to present our experiments with Vapour Phase Soldering, where the temperature distribution and heat transfer mechanisms were investigated on four test-boards with different substrates. We developed a method to measure the temperature gradients on- board inside an experimental vapour phase soldering oven. VP soldering process is suitable for consistent and rapid heating on boards from small scale to large ones with power components showing considerable thermal capacities. The measurements were performed on FR4, ceramic, alumina composite and flexible substrates, where the results show significant differences between the different materials, and point to investigations with thermal diffusivity for future research.
Czech name
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Czech description
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Classification
Type
D - Article in proceedings
CEP classification
JA - Electronics and optoelectronics
OECD FORD branch
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Result continuities
Project
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Continuities
V - Vyzkumna aktivita podporovana z jinych verejnych zdroju
Others
Publication year
2016
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů
Data specific for result type
Article name in the collection
2016 IEEE 22nd International Symposium for Design and Technology in Electronic Packaging (SIITME)
ISBN
978-1-5090-4446-7
ISSN
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e-ISSN
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Number of pages
4
Pages from-to
36-39
Publisher name
IEEE
Place of publication
New York
Event location
Oradea
Event date
Oct 20, 2016
Type of event by nationality
WRD - Celosvětová akce
UT code for WoS article
000390557400003