Study of temperature profile influence on intermetallic growth

Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F17%3A00316059" target="_blank" >RIV/68407700:21230/17:00316059 - isvavai.cz</a>
Result on the web
<a href="http://ieeexplore.ieee.org/document/8000922/" target="_blank" >http://ieeexplore.ieee.org/document/8000922/</a>
DOI - Digital Object Identifier
<a href="http://dx.doi.org/10.1109/ISSE.2017.8000922" target="_blank" >10.1109/ISSE.2017.8000922</a>

Result language
angličtina
Original language name
Study of temperature profile influence on intermetallic growth
Original language description
This article deals with the study of influence of temperature profile on the intermetallic layer growth and its thickness. There are many studies that observed the IMC growth, but only few evaluate the IMC growth in dependence on the heating factor. The heating factor is defined as an amount of heat added after the moment when the solder alloy is already in the liquid state. Two solder pastes, SnBi and Sn96.5/Ag3.0/Cu0.5 were used for experiments. Copper with OSP surface finish was chosen as a soldering material for the pads. The results confirm that it is the heating factor that has a decisive influence on the thickness of intermetallic layer.
Czech name
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Czech description
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Publication year
2017
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Article name in the collection
40th International Spring Seminar on Electronics Technology (ISSE)
ISBN
978-1-5386-0582-0
ISSN
2161-2536
e-ISSN
—
Number of pages
4
Pages from-to
—
Publisher name
IEEE
Place of publication
New York
Event location
Sofia
Event date
May 10, 2017
Type of event by nationality
WRD - Celosvětová akce
UT code for WoS article
000426973000045

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