Mechanical and Thermal Consequences of Added Phosphorus and Gallium in Lead-free Alloy Based on Bismuth and Tin

Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F21%3A00350915" target="_blank" >RIV/68407700:21230/21:00350915 - isvavai.cz</a>
Result on the web
<a href="https://doi.org/10.1109/ISSE51996.2021.9467640" target="_blank" >https://doi.org/10.1109/ISSE51996.2021.9467640</a>
DOI - Digital Object Identifier
<a href="http://dx.doi.org/10.1109/ISSE51996.2021.9467640" target="_blank" >10.1109/ISSE51996.2021.9467640</a>

Result language
angličtina
Original language name
Mechanical and Thermal Consequences of Added Phosphorus and Gallium in Lead-free Alloy Based on Bismuth and Tin
Original language description
The objective of this work is to examine the mechanical and thermal properties of novel lead-free bismuth-tin solder alloys with low melting temperature, each with a different percentage of added gallium and with phosphorus as a trace element. The motivation was to determine solder alloy with decreased melting point and maintain mechanical properties of eutectic bismuth-tin solder alloy at the same time. BiSn40, BiSn40P, BiSn40Ga1, BiSn40Ga1P, BiSn40Ga3, and BiSn40Ga3P were among the analyzed solder alloys. In addition, the same properties of BiSn42 were analyzed for comparison as a reference. The thermal properties were examined by differential thermal analysis, where the melting and solidification points were determined. The Vickers micro-hardness test was conducted for the observation of mechanical attributes. Moreover, the microstructure of the alloys was observed in a scanning electron microscope. The result of this study showed that the temperature of the melting point significantly decreased in the alloy BiSn40Ga3. Also, this alloy seems to have as sufficient mechanical properties as BiSn42. Therefore, it could possibly be used as a suitable substitution for the eutectic solder alloy.
Czech name
—
Czech description
—

Publication year
2021
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Article name in the collection
2021 44th International Spring Seminar on Electronics Technology (ISSE)
ISBN
978-1-6654-1477-7
ISSN
—
e-ISSN
2161-2528
Number of pages
5
Pages from-to
1-5
Publisher name
IEEE Press
Place of publication
New York
Event location
Bautzen
Event date
May 5, 2021
Type of event by nationality
WRD - Celosvětová akce
UT code for WoS article
—

Similar results(10)