Sn and Bi whisker growth from SAC0307-Mn07 and SAC0307-Bi1-Mn07 ultra-thin film layers

Result code in IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F21%3A00353555" target="_blank" >RIV/68407700:21230/21:00353555 - isvavai.cz</a>

Result on the web

<a href="https://doi.org/10.1016/j.vacuum.2021.110121" target="_blank" >https://doi.org/10.1016/j.vacuum.2021.110121</a>

DOI - Digital Object Identifier

<a href="http://dx.doi.org/10.1016/j.vacuum.2021.110121" target="_blank" >10.1016/j.vacuum.2021.110121</a>

Result language

angličtina

Original language name

Sn and Bi whisker growth from SAC0307-Mn07 and SAC0307-Bi1-Mn07 ultra-thin film layers

Original language description

In the past years, the use of low silver content SAC0307 (99Sn0.3Ag0.7Cu wt%) solder alloy grew considerably due to its good soldering quality. In the latest version of this alloy, manganese, and bismuth are used to improve further its soldering parameters. In this study, a reliability issue, the whisker growth from SAC0307-Mn07 and SAC0307-Bi1-Mn07 solder alloys was investigated. Ultra-thin films (in 100-150 nm thickness) were vacuum evaporated from the investigated alloys onto Cu substrates. The samples were stored at laboratory conditions for 28 days. Whisker growth was followed by a scanning electron microscope, and the ultra-thin film layers structures were investigated in focused ion beam cuts. In the case of the SAC0307-Mn07, the mechanical stress due to the intermetallic layer growth resulted in whisker formation right after the layer deposition. However, Bi addition could increase the stress relaxation ability of the ultra-thin film layer; the whisker formation started only three days after the evaporation in the case of the SAC0307-Bi1-Mn07 layer. Besides, the SAC0307-Bi1-Mn07 alloy could entirely suppress the formation of filament-type whiskers that might cause reliability issues in microelectronics. Furthermore, a unique phenomenon was observed that the SAC0307-Bi1-Mn07 layer produced mostly Bi-Sn whisker couples.

Czech name

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Czech description

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Type

J_imp - Article in a specialist periodical, which is included in the Web of Science database

CEP classification

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OECD FORD branch

20201 - Electrical and electronic engineering

Project

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Continuities

I - Institucionalni podpora na dlouhodoby koncepcni rozvoj vyzkumne organizace

Publication year

2021

Confidentiality

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Name of the periodical

Vacuum

ISSN

0042-207X

e-ISSN

1879-2715

Volume of the periodical

187

Issue of the periodical within the volume

110121

Country of publishing house

GB - UNITED KINGDOM

Number of pages

8

Pages from-to

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UT code for WoS article

000635459600004

EID of the result in the Scopus database

2-s2.0-85100624695