Effect of Cu Substrate Roughness and Sn Layer Thickness on Whisker Development from Sn Thin-Films
The result's identifiers
Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F19%3A00337343" target="_blank" >RIV/68407700:21230/19:00337343 - isvavai.cz</a>
Result on the web
<a href="https://doi.org/10.3390/ma12213609" target="_blank" >https://doi.org/10.3390/ma12213609</a>
DOI - Digital Object Identifier
<a href="http://dx.doi.org/10.3390/ma12213609" target="_blank" >10.3390/ma12213609</a>
Alternative languages
Result language
angličtina
Original language name
Effect of Cu Substrate Roughness and Sn Layer Thickness on Whisker Development from Sn Thin-Films
Original language description
The effect of copper substrate roughness and tin layer thickness were investigated on whisker development in the case of Sn thin-films. Sn was vacuum-evaporated onto both unpolished and mechanically polished Cu substrates with 1 mu m and 2 mu m average layer thicknesses. The samples were stored in room conditions for 60 days. The considerable stress-developed by the rapid intermetallic layer formation-resulted in intensive whisker formation, even in some days after the layer deposition. The developed whiskers and the layer structure underneath them were investigated with both scanning electron microscopy and ion microscopy. The Sn thin-film deposited onto unpolished Cu substrate produced less but longer whiskers than that deposited onto polished Cu substrate. This phenomenon might be explained by the dependence of IML formation on the surface roughness of substrates. The formation of IML wedges is more likely on rougher Cu substrates than on polished ones. Furthermore, it was found that with the decrease of layer thickness, the development of nodule type whiskers increases due to the easier diffusion of other atoms into the whisker bodies.
Czech name
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Czech description
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Classification
Type
J<sub>imp</sub> - Article in a specialist periodical, which is included in the Web of Science database
CEP classification
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OECD FORD branch
20201 - Electrical and electronic engineering
Result continuities
Project
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Continuities
I - Institucionalni podpora na dlouhodoby koncepcni rozvoj vyzkumne organizace
Others
Publication year
2019
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů
Data specific for result type
Name of the periodical
Materials
ISSN
1996-1944
e-ISSN
1996-1944
Volume of the periodical
12
Issue of the periodical within the volume
21
Country of publishing house
CH - SWITZERLAND
Number of pages
11
Pages from-to
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UT code for WoS article
000502798800150
EID of the result in the Scopus database
2-s2.0-85074634954