The influence of the crystallographic structure of the intermetallic grains on tin whisker growth
The result's identifiers
Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F19%3A00327713" target="_blank" >RIV/68407700:21230/19:00327713 - isvavai.cz</a>
Result on the web
<a href="https://doi.org/10.1016/j.jallcom.2019.01.247" target="_blank" >https://doi.org/10.1016/j.jallcom.2019.01.247</a>
DOI - Digital Object Identifier
<a href="http://dx.doi.org/10.1016/j.jallcom.2019.01.247" target="_blank" >10.1016/j.jallcom.2019.01.247</a>
Alternative languages
Result language
angličtina
Original language name
The influence of the crystallographic structure of the intermetallic grains on tin whisker growth
Original language description
In this paper, the relationship between the crystallographic structure of Cu-Sn intermetallic grains and Sn whisker growth was investigated. In order to prevent the influence of the elements in the alloy composition and the effect of the soldering process on the formation of the intermetallic layer, 99.99% pure Sn was vacuum evaporated onto Cu substrates. The Sn layer thickness was sub-micron region (~400 nm in average) to reach considerable and rapid compressive stress on the tin layer originated by the intermetallic formation. The samples were stored at room temperature for 1 month. Different types of whiskers (nodule and filament) and the layer structure underneath were studied with a scanning ion microscopy and transmission electron microscopy. It was found that not only the thickness of the intermetallic layer and shape of the intermetallic grains affects the whisker growth but the crystallo- graphic structure of the intermetallic grains as well. The susceptibility of the Sn layer to whisker development is higher in those regions where the intermetallic layer is composed of monocrystalline grains instead of those regions, where it is composed of polycrystalline grains. This effect can be explained by the higher compressive stress generated by the monocrystalline intermetallics compared to the polycrystalline ones.
Czech name
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Czech description
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Classification
Type
J<sub>imp</sub> - Article in a specialist periodical, which is included in the Web of Science database
CEP classification
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OECD FORD branch
20201 - Electrical and electronic engineering
Result continuities
Project
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Continuities
I - Institucionalni podpora na dlouhodoby koncepcni rozvoj vyzkumne organizace
Others
Publication year
2019
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů
Data specific for result type
Name of the periodical
Journal of Alloys and Compounds
ISSN
0925-8388
e-ISSN
1873-4669
Volume of the periodical
785
Issue of the periodical within the volume
May
Country of publishing house
NL - THE KINGDOM OF THE NETHERLANDS
Number of pages
7
Pages from-to
774-780
UT code for WoS article
000460386900093
EID of the result in the Scopus database
2-s2.0-85060554965