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Influence of No-Clean Flux on The Corrosivity of Copper After Reflow

The result's identifiers

  • Result code in IS VaVaI

    <a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F22%3A00358743" target="_blank" >RIV/68407700:21230/22:00358743 - isvavai.cz</a>

  • Result on the web

    <a href="https://doi.org/10.1109/ISSE54558.2022.9812708" target="_blank" >https://doi.org/10.1109/ISSE54558.2022.9812708</a>

  • DOI - Digital Object Identifier

    <a href="http://dx.doi.org/10.1109/ISSE54558.2022.9812708" target="_blank" >10.1109/ISSE54558.2022.9812708</a>

Alternative languages

  • Result language

    angličtina

  • Original language name

    Influence of No-Clean Flux on The Corrosivity of Copper After Reflow

  • Original language description

    The use of flux when soldering is essential to obtain a reliable solder joint. No-clean fluxes are most often used in lead-free soldering. This raises the question of the need to clean the flux residues due to their aggressiveness. The purpose of this work is to understand the importance of the flux chemistry and impact of weak organic acids (WOAs) on the corrosivity of copper surface after reflow. During this investigation the aggressiveness of six different no-clean fluxes for lead-free soldering on toward copper surface was observed. The results showed the flux aggressiveness depended on the flux composition. Fluxes Weller Lötwasser and Topnik RF800 showed less aggressive effect toward copper surface after heat treatment. The results of the study also showed that one of more aggressive fluxes, such as Topnik LP-1, corroded the copper surface to a depth of about 50 μm.

  • Czech name

  • Czech description

Classification

  • Type

    D - Article in proceedings

  • CEP classification

  • OECD FORD branch

    20201 - Electrical and electronic engineering

Result continuities

  • Project

  • Continuities

    S - Specificky vyzkum na vysokych skolach

Others

  • Publication year

    2022

  • Confidentiality

    S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Data specific for result type

  • Article name in the collection

    2022 45th International Spring Seminar on Electronics Technology (ISSE)

  • ISBN

    978-1-6654-6589-2

  • ISSN

    2161-2528

  • e-ISSN

    2161-2536

  • Number of pages

    6

  • Pages from-to

    1-6

  • Publisher name

    IEEE Press

  • Place of publication

    New York

  • Event location

    Vienna

  • Event date

    May 11, 2022

  • Type of event by nationality

    WRD - Celosvětová akce

  • UT code for WoS article

    000853642200002