Influence of No-Clean Flux on The Corrosivity of Copper After Reflow
The result's identifiers
Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F22%3A00358743" target="_blank" >RIV/68407700:21230/22:00358743 - isvavai.cz</a>
Result on the web
<a href="https://doi.org/10.1109/ISSE54558.2022.9812708" target="_blank" >https://doi.org/10.1109/ISSE54558.2022.9812708</a>
DOI - Digital Object Identifier
<a href="http://dx.doi.org/10.1109/ISSE54558.2022.9812708" target="_blank" >10.1109/ISSE54558.2022.9812708</a>
Alternative languages
Result language
angličtina
Original language name
Influence of No-Clean Flux on The Corrosivity of Copper After Reflow
Original language description
The use of flux when soldering is essential to obtain a reliable solder joint. No-clean fluxes are most often used in lead-free soldering. This raises the question of the need to clean the flux residues due to their aggressiveness. The purpose of this work is to understand the importance of the flux chemistry and impact of weak organic acids (WOAs) on the corrosivity of copper surface after reflow. During this investigation the aggressiveness of six different no-clean fluxes for lead-free soldering on toward copper surface was observed. The results showed the flux aggressiveness depended on the flux composition. Fluxes Weller Lötwasser and Topnik RF800 showed less aggressive effect toward copper surface after heat treatment. The results of the study also showed that one of more aggressive fluxes, such as Topnik LP-1, corroded the copper surface to a depth of about 50 μm.
Czech name
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Czech description
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Classification
Type
D - Article in proceedings
CEP classification
—
OECD FORD branch
20201 - Electrical and electronic engineering
Result continuities
Project
—
Continuities
S - Specificky vyzkum na vysokych skolach
Others
Publication year
2022
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů
Data specific for result type
Article name in the collection
2022 45th International Spring Seminar on Electronics Technology (ISSE)
ISBN
978-1-6654-6589-2
ISSN
2161-2528
e-ISSN
2161-2536
Number of pages
6
Pages from-to
1-6
Publisher name
IEEE Press
Place of publication
New York
Event location
Vienna
Event date
May 11, 2022
Type of event by nationality
WRD - Celosvětová akce
UT code for WoS article
000853642200002