Testing of fluxes aggression
The result's identifiers
Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F12%3A00199228" target="_blank" >RIV/68407700:21230/12:00199228 - isvavai.cz</a>
Result on the web
—
DOI - Digital Object Identifier
—
Alternative languages
Result language
angličtina
Original language name
Testing of fluxes aggression
Original language description
The process of soldering plays an important role in electrical engineering. Soldering is the process of joining two metals with a solder alloy. On the surface of the soldering material is formed an oxide layer which must be removed before soldering. Fluxes are used for this reason. Flux is a substance that removes oxides from the surface of soldering materials. On the other hand flux can cause problems with future reliability due to aggressive residues which have conductive or corrosive properties. Thisarticle is aimed to the testing of fluxes aggression on the copper surface.
Czech name
—
Czech description
—
Classification
Type
D - Article in proceedings
CEP classification
JA - Electronics and optoelectronics
OECD FORD branch
—
Result continuities
Project
—
Continuities
S - Specificky vyzkum na vysokych skolach
Others
Publication year
2012
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů
Data specific for result type
Article name in the collection
16th International Student Conference on Electrical Engineering
ISBN
978-80-01-05043-9
ISSN
—
e-ISSN
—
Number of pages
4
Pages from-to
1-4
Publisher name
ČVUT, Fakulta elektrotechnická
Place of publication
Praha
Event location
Praha
Event date
May 17, 2012
Type of event by nationality
EUR - Evropská akce
UT code for WoS article
—