Influence of No-Clean Flux on the Corrosivity of Various Surface Finishes After Reflow
The result's identifiers
Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F23%3A00368034" target="_blank" >RIV/68407700:21230/23:00368034 - isvavai.cz</a>
Result on the web
<a href="https://ieeexplore.ieee.org/document/10168358" target="_blank" >https://ieeexplore.ieee.org/document/10168358</a>
DOI - Digital Object Identifier
<a href="http://dx.doi.org/10.1109/ISSE57496.2023.10168358" target="_blank" >10.1109/ISSE57496.2023.10168358</a>
Alternative languages
Result language
angličtina
Original language name
Influence of No-Clean Flux on the Corrosivity of Various Surface Finishes After Reflow
Original language description
High-quality soldered joint is necessary for the trouble-free operation of electronic equipment. The quality of the soldered joint is determined by several parameters. One of the parameters is the type of used flux. There are no-clean fluxes and fluxes that must be cleaned after the soldering process. Today, no-clean fluxes are widely used. This work is a continuation of the study [1] and it is focused on studying the effect of flux aggressiveness on commonly used PCB surfaces such as electroless nickel immersion gold (ENIG), immersion tin, and organic solderability preservative (OSP). Five fluxes with different classifications were investigated in the work: Weller Lötwasser, Topnik RF800, Topnik TE - 400, Topnik ESW 32, and Topnik LP-1. The most aggressive influence showed no-clean fluxes Topnik TE-410 and Topnik LP-1. These fluxes corroded the OSP surface by at least 0.5 μm. The results also showed the most resistant type of surface finish was ENIG and the most susceptible to no-clean flux aggressiveness was OSP.
Czech name
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Czech description
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Classification
Type
D - Article in proceedings
CEP classification
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OECD FORD branch
20201 - Electrical and electronic engineering
Result continuities
Project
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Continuities
S - Specificky vyzkum na vysokych skolach
Others
Publication year
2023
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů
Data specific for result type
Article name in the collection
2023 46th International Spring Seminar on Electronics Technology (ISSE)
ISBN
979-8-3503-3484-5
ISSN
2161-2528
e-ISSN
2161-2536
Number of pages
4
Pages from-to
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Publisher name
IEEE Press
Place of publication
New York
Event location
Temešvár
Event date
May 10, 2023
Type of event by nationality
WRD - Celosvětová akce
UT code for WoS article
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