Comparison of Rosin Fluxes

Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F49777513%3A23220%2F13%3A43919722" target="_blank" >RIV/49777513:23220/13:43919722 - isvavai.cz</a>
Result on the web
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DOI - Digital Object Identifier
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Result language
angličtina
Original language name
Comparison of Rosin Fluxes
Original language description
This article will present results of activity testing of rosin fluxes. A good solderability of a component output and a soldering pad of PCB are important for the creation of a quality joint. Since it supports a melted solder wetting on a soldered surface, a flux has a definitive influence on the creation of a quality joint. Further, it removes oxides and other impurities from soldering alloys and prevents from a creation of a new oxide layer during soldering. According the technology of a solder jointcreation, a flux is added into the soldering process in different ways. The aim of the test was to select a rosin flux having with the solder tube the best results during soldering of the copper surface on PCB's. Fluxes were compared by the help of two different tests. The first trial was carried out by the area of spread method, since this test is suitable for solderability testing of materials and comparison of a flux activity. The wetting balance test was chosen as the second trial. T
Czech name
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Czech description
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Type
J<sub>x</sub> - Unclassified - Peer-reviewed scientific article (Jimp, Jsc and Jost)
CEP classification
JA - Electronics and optoelectronics
OECD FORD branch
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Publication year
2013
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

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