Wetting Balance Test of Tin-Based Solder Alloys: Effect of Oxide Removal on Wetting Performance

Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F25%3A00384650" target="_blank" >RIV/68407700:21230/25:00384650 - isvavai.cz</a>
Result on the web
<a href="https://doi.org/10.1109/ISSE65583.2025.11121031" target="_blank" >https://doi.org/10.1109/ISSE65583.2025.11121031</a>
DOI - Digital Object Identifier
<a href="http://dx.doi.org/10.1109/ISSE65583.2025.11121031" target="_blank" >10.1109/ISSE65583.2025.11121031</a>

Result language
angličtina
Original language name
Wetting Balance Test of Tin-Based Solder Alloys: Effect of Oxide Removal on Wetting Performance
Original language description
This study investigates the influence of the dwell time between the mechanical oxide removal from the surface of the molten solder by a scraper and the initiation of the wetting balance test on the wettability of copper. This prolongation could potentially influence soldering performance and has not been studied yet. Copper wire with a cross-sectional area of 1.5 mm2, rosin-based flux, and three different lead-free solder alloys (SnAg3Cu0.5,SnAg4, and SnCu3) were utilized for this experiment. Our findings revealed that the oxidation of the solder surface during the time delay of up to 10 minutes has a negligible effect on the wettability of the copper for all of the utilized alloys regardless of the flux application. However, when no flux was applied to the Cu wire, this time delay affected wetting behavior, particularly of SnAg4 and SnCu3 alloys, which exhibited heightened surface oxidation sensitivity in contrast to SnAg3Cu0.5. These results demonstrated that it is not necessary to extensively monitor the cleanliness of the molten solder surface during the wetting balance test, nor in processes like wave soldering.
Czech name
—
Czech description
—

Publication year
2025
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Article name in the collection
2025 International Spring Seminar on Electronics Technology (ISSE)
ISBN
979-8-3315-1217-0
ISSN
2161-2536
e-ISSN
2161-2528
Number of pages
4
Pages from-to
—
Publisher name
Institute of Electrical and Electronics Engineers
Place of publication
New York
Event location
Budapešť
Event date
May 14, 2025
Type of event by nationality
WRD - Celosvětová akce
UT code for WoS article
001585293500074

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