Suppression of Sn whisker growth from SnAgCu solder alloy with TiO2 and ZnO reinforcement nano-particles by increasing the corrosion resistance of the composite alloy

Result code in IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F22%3A00360459" target="_blank" >RIV/68407700:21230/22:00360459 - isvavai.cz</a>

Result on the web

<a href="https://doi.org/10.1016/j.jmrt.2022.08.172" target="_blank" >https://doi.org/10.1016/j.jmrt.2022.08.172</a>

DOI - Digital Object Identifier

<a href="http://dx.doi.org/10.1016/j.jmrt.2022.08.172" target="_blank" >10.1016/j.jmrt.2022.08.172</a>

Result language

angličtina

Original language name

Suppression of Sn whisker growth from SnAgCu solder alloy with TiO2 and ZnO reinforcement nano-particles by increasing the corrosion resistance of the composite alloy

Original language description

The main joining process of the electronic industry is still soldering with different alloys of Sn. This work studied the relationship between Sn whisker growth and corrosion resis-tance of 99Sn0.3Ag0.7Cu-TiO2/ZnO (0.25wt%) composite solder alloys in a corrosive envi-ronment via scanning electron microscopy and focused ion beam techniques. The corrosive environment test showed that the application of TiO2 and ZnO nano-particles almost totally suppressed the Sn whisker growth and improved the corrosion resistance of the composite solder alloys compared to the reference 99Sn0.3Ag0.7Cu alloy. The microstructural analysis of the reference 99Sn0.3Ag0.7Cu solder alloy showed that the volumetric increase of the corroded b-Sn grains resulted in local mechanical stress in the solder joints, which was released by Sn whisker development. However, in the composite solder joints, the increased grain boundary fraction and segregation of the TiO2 and ZnO nano-particles to the grain boundaries resulted in a relatively uniform and compact pro-tective oxide layer at the b-Sn grain boundaries. This suppressed the formation of SnOx, and via this, the corrosion-induced whisker growth.(c) 2022 The Author(s). Published by Elsevier B.V. This is an open access article under the CC BY-NC-ND license (http://creativecommons.org/licenses/by-nc-nd/4.0/).

Czech name

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Czech description

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Type

J_imp - Article in a specialist periodical, which is included in the Web of Science database

CEP classification

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OECD FORD branch

20201 - Electrical and electronic engineering

Project

—

Continuities

I - Institucionalni podpora na dlouhodoby koncepcni rozvoj vyzkumne organizace

Publication year

2022

Confidentiality

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Name of the periodical

Journal of Materials Research and Technology

ISSN

2238-7854

e-ISSN

2214-0697

Volume of the periodical

20

Issue of the periodical within the volume

09-10

Country of publishing house

CH - SWITZERLAND

Number of pages

10

Pages from-to

4231-4240

UT code for WoS article

000862508700007

EID of the result in the Scopus database

2-s2.0-85144727881