Effects of ZrO2 Nano-Particles' Incorporation into SnAgCu Solder Alloys: An Experimental and Theoretical Study

Result code in IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F24%3A00378861" target="_blank" >RIV/68407700:21230/24:00378861 - isvavai.cz</a>

Result on the web

<a href="https://doi.org/10.3390/nano14201636" target="_blank" >https://doi.org/10.3390/nano14201636</a>

DOI - Digital Object Identifier

<a href="http://dx.doi.org/10.3390/nano14201636" target="_blank" >10.3390/nano14201636</a>

Result language

angličtina

Original language name

Effects of ZrO2 Nano-Particles' Incorporation into SnAgCu Solder Alloys: An Experimental and Theoretical Study

Original language description

This study investigates the mechanism and effects of incorporating different ZrO2 nano-particles into SAC0307 solder alloys. ZrO2 nano-powder and nano-fibers in 0.25-0.5 wt% were added to the SAC0307 alloy to prepare composite solder joints by surface mount technology. The solder joints were shear tested before and after a 4000 h long 85 degrees C/85% RH corrosive reliability test. The incorporation of ZrO2 nano-particles enhanced the initial shear force of the solder joint, but they decreased the corrosion resistance in the case of 0.5 wt%. SEM, EDS, and FIB analysis revealed intensive growth of SnO2 on the solder joint surfaces, leading to the formation of Sn whiskers. Density functional theory (DFT) simulations showed that, despite Sn being able to bond to the surface of ZrO2, the binding energy was weak, and the whole system was therefore unstable. It was also found that ZrO2 nano-particles refined the microstructure of the solder joints. Decreased beta-Sn grain size and more dispersed intermetallic compounds were observed. The microstructural refinement caused mechanical improvement of the ZrO2 composite solder joints by dispersion strengthening but could also decrease their corrosion resistance. While ZrO2 nano-particles improved the solder joint mechanical properties, their use is recommended only in non-corrosive environments, such as microelectronics for space applications.

Czech name

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Czech description

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Type

J_imp - Article in a specialist periodical, which is included in the Web of Science database

CEP classification

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OECD FORD branch

20201 - Electrical and electronic engineering

Project

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Continuities

I - Institucionalni podpora na dlouhodoby koncepcni rozvoj vyzkumne organizace

Publication year

2024

Confidentiality

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Name of the periodical

Nanomaterials

ISSN

2079-4991

e-ISSN

2079-4991

Volume of the periodical

14

Issue of the periodical within the volume

20

Country of publishing house

CH - SWITZERLAND

Number of pages

17

Pages from-to

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UT code for WoS article

001342245100001

EID of the result in the Scopus database

2-s2.0-85207667012