Dispersion and incorporation of TiO2 and SiC nano-particles in SAC alloy: SIMS and DFT study
The result's identifiers
Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F24%3A00378858" target="_blank" >RIV/68407700:21230/24:00378858 - isvavai.cz</a>
Result on the web
<a href="https://doi.org/10.1016/j.scriptamat.2024.115987" target="_blank" >https://doi.org/10.1016/j.scriptamat.2024.115987</a>
DOI - Digital Object Identifier
<a href="http://dx.doi.org/10.1016/j.scriptamat.2024.115987" target="_blank" >10.1016/j.scriptamat.2024.115987</a>
Alternative languages
Result language
angličtina
Original language name
Dispersion and incorporation of TiO2 and SiC nano-particles in SAC alloy: SIMS and DFT study
Original language description
Ceramic nano-particles are frequently used as reinforcements in SAC alloys to improve their mechanical properties; however, the nano-particle dispersion and incorporation mechanisms are not well known. Composite SAC alloys were prepared from Sn99Ag0.3Cu0.7 alloy with TiO2 and SiC nano-particles in 0.5wt%. Solder joints were prepared by SMT technology between two Cu plates with 150 mu m thickness. SIMS was used to determine the nano-particle distribution along the solder joints' vertical cross-section. DFT calculations were done to investigate the possible interaction between the different nano-particles and the Sn atoms. SIMS results showed that the distribution of the nano-particles is inhomogeneous in the solder bulk; furthermore, the density characteristics highly depend on the size and shape of the nano-particles. DFT calculations proved that the non-soluble TiO2 and SiC could form chemical bonds with the Sn during the soldering, which might further explain their positive effect on the physical properties of composite SAC alloys.
Czech name
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Czech description
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Classification
Type
J<sub>imp</sub> - Article in a specialist periodical, which is included in the Web of Science database
CEP classification
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OECD FORD branch
20201 - Electrical and electronic engineering
Result continuities
Project
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Continuities
I - Institucionalni podpora na dlouhodoby koncepcni rozvoj vyzkumne organizace
Others
Publication year
2024
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů
Data specific for result type
Name of the periodical
Scripta Materialia
ISSN
1359-6462
e-ISSN
1872-8456
Volume of the periodical
243
Issue of the periodical within the volume
115987
Country of publishing house
US - UNITED STATES
Number of pages
6
Pages from-to
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UT code for WoS article
001162493000001
EID of the result in the Scopus database
2-s2.0-85182608738