Solderless Component Assembly: Novel Ecological Approach to Electronics Production

Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F23%3A00367196" target="_blank" >RIV/68407700:21230/23:00367196 - isvavai.cz</a>
Result on the web
<a href="https://doi.org/10.1109/ISSE57496.2023.10168409" target="_blank" >https://doi.org/10.1109/ISSE57496.2023.10168409</a>
DOI - Digital Object Identifier
<a href="http://dx.doi.org/10.1109/ISSE57496.2023.10168409" target="_blank" >10.1109/ISSE57496.2023.10168409</a>

Result language
angličtina
Original language name
Solderless Component Assembly: Novel Ecological Approach to Electronics Production
Original language description
This work aimed to evaluate a new approach to electronics manufacturing using recycled and recyclable 3D-printed polymers as an insulation substrate and printing of conductive silver ink as a conductive pattern. Furthermore, connection to the board is realized via embedding the components into the substrate and the ink's overprints. The first results from the measurements showed that this type of connection is comparable to conductive adhesive joints regarding contact resistance. Also, the behavior of the joints during accelerated aging by thermal shocks is relatively acceptable from a reliability point of view. A significant advantage of this manufacturing method is the absence of the high-temperature heating processes and, thus, energy savings compared to conventional production processes. Also, the final product is easily recyclable after its functional life. On the other hand, the overall quality is lower than that of standard printed circuit boards consisting of FR4 substrate and the copper conductive layer. The range of available and suitable components is also much smaller. The proposed solution could find applications primarily in low-cost electronics or prototyping.
Czech name
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Czech description
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Publication year
2023
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Article name in the collection
2023 46th International Spring Seminar on Electronics Technology (ISSE)
ISBN
979-8-3503-3484-5
ISSN
2161-2528
e-ISSN
2161-2536
Number of pages
6
Pages from-to
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Publisher name
IEEE Press
Place of publication
New York
Event location
Temešvár
Event date
May 10, 2023
Type of event by nationality
WRD - Celosvětová akce
UT code for WoS article
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