Analysis of Composite BiSn Solder Paste Doped by Titanium Dioxide Nanoparticles
The result's identifiers
Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F24%3A00375670" target="_blank" >RIV/68407700:21230/24:00375670 - isvavai.cz</a>
Result on the web
<a href="https://doi.org/10.1109/ISSE61612.2024.10604211" target="_blank" >https://doi.org/10.1109/ISSE61612.2024.10604211</a>
DOI - Digital Object Identifier
<a href="http://dx.doi.org/10.1109/ISSE61612.2024.10604211" target="_blank" >10.1109/ISSE61612.2024.10604211</a>
Alternative languages
Result language
angličtina
Original language name
Analysis of Composite BiSn Solder Paste Doped by Titanium Dioxide Nanoparticles
Original language description
The aim of this work was to evaluate the effect of 0.1 wt.% titanium dioxide nanoparticles (NPs) incorporated in low-temperature Bi58Sn42 solder paste on spreading behavior and mechanical and thermal properties. The spreading test was conducted on testing printed circuit boards with an Organic Solderability Preservative (OSP) surface protection of copper layer. Mechanical properties were evaluated by a shear strength test of 1206 resistors soldered on FR4 boards with OSP coating. Shear strength was also studied in dependence on accelerated thermal aging. The prepared test boards for the shear test were annealed in a climatic chamber at 85°C and 100°C for 1000 hours. Additionally, the solder alloys were subjected to Differential Scanning Calorimetry (DSC) to examine their thermal properties. The results showed a significant improvement in spreading when using solder paste with incorporated TiO2 NPs. Furthermore, TiO2 nanoparticles did not prominently deteriorate the thermal and mechanical properties.
Czech name
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Czech description
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Classification
Type
D - Article in proceedings
CEP classification
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OECD FORD branch
20501 - Materials engineering
Result continuities
Project
—
Continuities
S - Specificky vyzkum na vysokych skolach
Others
Publication year
2024
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů
Data specific for result type
Article name in the collection
2024 47th International Spring Seminar on Electronics Technology (ISSE)
ISBN
979-8-3503-8548-9
ISSN
2161-2536
e-ISSN
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Number of pages
5
Pages from-to
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Publisher name
IEEE Press
Place of publication
New York
Event location
Praha
Event date
May 15, 2024
Type of event by nationality
WRD - Celosvětová akce
UT code for WoS article
001283808200086