An Expired Solder Paste vs Fresh Solder Paste: Reliability and Sustainability in Electronics Manufacturing

Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F24%3A00376744" target="_blank" >RIV/68407700:21230/24:00376744 - isvavai.cz</a>
Result on the web
<a href="https://doi.org/10.1109/ISSE61612.2024.10604132" target="_blank" >https://doi.org/10.1109/ISSE61612.2024.10604132</a>
DOI - Digital Object Identifier
<a href="http://dx.doi.org/10.1109/ISSE61612.2024.10604132" target="_blank" >10.1109/ISSE61612.2024.10604132</a>

Result language
angličtina
Original language name
An Expired Solder Paste vs Fresh Solder Paste: Reliability and Sustainability in Electronics Manufacturing
Original language description
Two types of solder paste, where for each there were three production / expiry dates, were compared on a gas chromatography and evaluated in terms of their application using stencil printing on a copper substrate (OSP surface finish). The number, percentage, and number of macrovoids were evaluated and compared. Altogether, six solder paste samples were tested, for each solder paste, the voids were evaluated using X-ray spectroscopy on 14 pads with a 1206 pad size. Despite the results from the gas chromatography showed the effect of solder paste aging, the voiding of the pastes did not differ significantly and, on the contrary, the percentage representation of voids was the smallest with the oldest solder paste.
Czech name
—
Czech description
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Publication year
2024
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Article name in the collection
2024 47th International Spring Seminar on Electronics Technology (ISSE)
ISBN
979-8-3503-8548-9
ISSN
2161-2536
e-ISSN
—
Number of pages
4
Pages from-to
—
Publisher name
IEEE Press
Place of publication
New York
Event location
Praha
Event date
May 15, 2024
Type of event by nationality
WRD - Celosvětová akce
UT code for WoS article
001283808200071

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