Influence of Stencil Thickness and Surface Finishes of Soldering Pads on the Formation of the Voids Inside Solder Joints
The result's identifiers
Result code in IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21230%2F25%3A00386744" target="_blank" >RIV/68407700:21230/25:00386744 - isvavai.cz</a>
Result on the web
<a href="https://doi.org/10.1109/ISSE65583.2025.11120946" target="_blank" >https://doi.org/10.1109/ISSE65583.2025.11120946</a>
DOI - Digital Object Identifier
<a href="http://dx.doi.org/10.1109/ISSE65583.2025.11120946" target="_blank" >10.1109/ISSE65583.2025.11120946</a>
Alternative languages
Result language
angličtina
Original language name
Influence of Stencil Thickness and Surface Finishes of Soldering Pads on the Formation of the Voids Inside Solder Joints
Original language description
This article focuses on the formation of the voids inside the solder joints during reflow soldering in surface mount technology (SMT). The stencil printing technology is commonly used during SMT for the solder paste deposition on the printed circuit boards (PCBs) respectively on the soldering pads. The stencil can have different thicknesses according to the requests. The thicknesses 100, 150 and 200 μm were chosen for the study of the stencil thickness influence on the voids formation inside the solder joints. The results showed that the number of macrovoids is lowest for the thickest stencil; on the other hand, the surface area of the macrovoids is highest for the thickest stencil. Additionally, we used three different surface finishes (organic surface preservative - OSP, hot air solder levelling HASL and electroless nickel immersion gold - ENIG) of soldering pads in the experiment to study the influence of surface finishes on the voids formation. When the lowest voids formation was observed in the case of HASL surface finish and highest in the OSP.
Czech name
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Czech description
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Classification
Type
D - Article in proceedings
CEP classification
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OECD FORD branch
20201 - Electrical and electronic engineering
Result continuities
Project
—
Continuities
S - Specificky vyzkum na vysokych skolach
Others
Publication year
2025
Confidentiality
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů
Data specific for result type
Article name in the collection
2025 International Spring Seminar on Electronics Technology (ISSE)
ISBN
979-8-3315-1217-0
ISSN
2161-2536
e-ISSN
2161-2528
Number of pages
4
Pages from-to
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Publisher name
Institute of Electrical and Electronics Engineers
Place of publication
New York
Event location
Budapešť
Event date
May 14, 2025
Type of event by nationality
WRD - Celosvětová akce
UT code for WoS article
001585293500028