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Deep learning techniques for integrated circuit die performance prediction

The result's identifiers

  • Result code in IS VaVaI

    <a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F68407700%3A21240%2F22%3A00365085" target="_blank" >RIV/68407700:21240/22:00365085 - isvavai.cz</a>

  • Result on the web

    <a href="https://doi.org/10.1557/s43580-022-00308-0" target="_blank" >https://doi.org/10.1557/s43580-022-00308-0</a>

  • DOI - Digital Object Identifier

    <a href="http://dx.doi.org/10.1557/s43580-022-00308-0" target="_blank" >10.1557/s43580-022-00308-0</a>

Alternative languages

  • Result language

    angličtina

  • Original language name

    Deep learning techniques for integrated circuit die performance prediction

  • Original language description

    Predicting integrated circuit (IC) functionality based on process control monitoring (PCM) parameters without individual die testing is a major challenge for manufacturers due to the high cost of electrical die measurement on the wafer. Complex dependencies between individual PCM parameters can be used to explain certain patterns of dice failure using Deep learning (DL) algorithms. However, random failure patterns due to process defects cannot be detected by this method. Combining PCM and in-process defect inspection data can be an ultimate prediction technique. In some cases, however, the availability of defect inspection data is much lower than the availability of PCM data, so direct ensemble training is rather ambiguous. This paper shows how to efficiently utilize both defect and PCM data to train a model to predict IC functionality. Such a hybrid model outperforms PCM-only solutions, and in contrast to a defect-only model predicts also failure areas across the wafer.

  • Czech name

  • Czech description

Classification

  • Type

    J<sub>SC</sub> - Article in a specialist periodical, which is included in the SCOPUS database

  • CEP classification

  • OECD FORD branch

    20201 - Electrical and electronic engineering

Result continuities

  • Project

  • Continuities

    I - Institucionalni podpora na dlouhodoby koncepcni rozvoj vyzkumne organizace

Others

  • Publication year

    2022

  • Confidentiality

    S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Data specific for result type

  • Name of the periodical

    MRS Advances

  • ISSN

    2059-8521

  • e-ISSN

    2059-8521

  • Volume of the periodical

    7

  • Issue of the periodical within the volume

    30

  • Country of publishing house

    GB - UNITED KINGDOM

  • Number of pages

    6

  • Pages from-to

    683-688

  • UT code for WoS article

    000838469100001

  • EID of the result in the Scopus database

    2-s2.0-85135779047