Modelling of Transient Thermal Stress in Layered Walls

Result code in IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F70883521%3A28110%2F10%3A63509336" target="_blank" >RIV/70883521:28110/10:63509336 - isvavai.cz</a>

Result on the web

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DOI - Digital Object Identifier

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Result language

angličtina

Original language name

Modelling of Transient Thermal Stress in Layered Walls

Original language description

Results of FEM modelling of transient thermal stress analysis in layered walls are given in the article. It is shown that thermal stress alone is not solely caused by differences in coefficients of thermal expansion of individual layers. The emergence oftransient thermal stress is subject to both the layered structure of the wall and given boundary conditions, as well as the existence of a temperature gradient in the direction normal to the surface of the wall. A practical application focuses on the issue of recycling of PCB boards with the effort to achieve separation of layers due to thermal stress. Role modelling of thermal stress in this area lies in predicting the possibility of separation, depending on the type of thermal stress and material parameters.

Czech name

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Czech description

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Type

J_x - Unclassified - Peer-reviewed scientific article (Jimp, Jsc and Jost)

CEP classification

JI - Composite materials

OECD FORD branch

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Project

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Continuities

V - Vyzkumna aktivita podporovana z jinych verejnych zdroju

Publication year

2010

Confidentiality

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Name of the periodical

Manufacturing Technology

ISSN

1213-2489

e-ISSN

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Volume of the periodical

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Issue of the periodical within the volume

10

Country of publishing house

CZ - CZECH REPUBLIC

Number of pages

4

Pages from-to

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UT code for WoS article

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EID of the result in the Scopus database

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