Facilitated low-temperature continuous dynamic recrystallization in selectively laser melted AlSi10Mg alloy

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F00216208%3A11320%2F25%3A10511305" target="_blank" >RIV/00216208:11320/25:10511305 - isvavai.cz</a>

Výsledek na webu

<a href="https://verso.is.cuni.cz/pub/verso.fpl?fname=obd_publikace_handle&handle=peBaLTcelu" target="_blank" >https://verso.is.cuni.cz/pub/verso.fpl?fname=obd_publikace_handle&handle=peBaLTcelu</a>

DOI - Digital Object Identifier

<a href="http://dx.doi.org/10.1016/j.jallcom.2025.183371" target="_blank" >10.1016/j.jallcom.2025.183371</a>

Jazyk výsledku

angličtina

Název v původním jazyce

Facilitated low-temperature continuous dynamic recrystallization in selectively laser melted AlSi10Mg alloy

Popis výsledku v původním jazyce

Recrystallization in conventionally cast AlSi10Mg typically occurs at elevated temperatures due to coarse grains and low dislocation densities, with most studies reporting dynamic recrystallization onset above 300-400 degrees C. In contrast, Selective Laser Melting (SLM) produces a fine cellular substructure with high dislocation density and residual stresses, which reduces the energy barrier for recrystallization. This study investigates the microstructural evolution of SLMed AlSi10Mg during compressive deformation at 100 degrees C. The fraction of fine grains increases from 31.8 % to 60.6 %, accompanied by a rise in low-angle grain boundaries from 10.9 % to 32.3 %. Kernel Average Misorientation and Grain Orientation Spread maps confirm the activation of continuous dynamic recrystallization, even at this low temperature. Notably, the stress-strain curves exhibit clear flow softening behavior at 100 degrees C, with a softening fraction exceeding 10 %. The results demonstrate that the substructure developed during SLM facilitates low-temperature recrystallization, and contributes directly to the observed flow softening.

Název v anglickém jazyce

Facilitated low-temperature continuous dynamic recrystallization in selectively laser melted AlSi10Mg alloy

Popis výsledku anglicky

Recrystallization in conventionally cast AlSi10Mg typically occurs at elevated temperatures due to coarse grains and low dislocation densities, with most studies reporting dynamic recrystallization onset above 300-400 degrees C. In contrast, Selective Laser Melting (SLM) produces a fine cellular substructure with high dislocation density and residual stresses, which reduces the energy barrier for recrystallization. This study investigates the microstructural evolution of SLMed AlSi10Mg during compressive deformation at 100 degrees C. The fraction of fine grains increases from 31.8 % to 60.6 %, accompanied by a rise in low-angle grain boundaries from 10.9 % to 32.3 %. Kernel Average Misorientation and Grain Orientation Spread maps confirm the activation of continuous dynamic recrystallization, even at this low temperature. Notably, the stress-strain curves exhibit clear flow softening behavior at 100 degrees C, with a softening fraction exceeding 10 %. The results demonstrate that the substructure developed during SLM facilitates low-temperature recrystallization, and contributes directly to the observed flow softening.

Druh

J_imp - Článek v periodiku v databázi Web of Science

CEP obor

—

OECD FORD obor

10302 - Condensed matter physics (including formerly solid state physics, supercond.)

Projekt

—

Návaznosti

I - Institucionalni podpora na dlouhodoby koncepcni rozvoj vyzkumne organizace

Rok uplatnění

2025

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů

Název periodika

Journal of Alloys and Compounds

ISSN

0925-8388

e-ISSN

1873-4669

Svazek periodika

1039

Číslo periodika v rámci svazku

neuveden

Stát vydavatele periodika

CH - Švýcarská konfederace

Počet stran výsledku

7

Strana od-do

183371

Kód UT WoS článku

001563099100011

EID výsledku v databázi Scopus

2-s2.0-105014606172