Interaction of Cu, Sn, and Ag nano-powders with Cu substrate

Kód výsledku v IS VaVaI

<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F00216224%3A14310%2F09%3A00049594" target="_blank" >RIV/00216224:14310/09:00049594 - isvavai.cz</a>

Výsledek na webu

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DOI - Digital Object Identifier

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Jazyk výsledku

angličtina

Název v původním jazyce

Interaction of Cu, Sn, and Ag nano-powders with Cu substrate

Popis výsledku v původním jazyce

The contribution deals with nano-particles and raised from selected pure metals (Cu, Ag, Sn). The temperature behaviours of these powders under inert atmosphere and under reactive gas are studied as well as the particles / Cu substrate systems. The measurements of the thermal stability of the metal particles were obtained using DSC. It enables to evaluate heat effects of oxidation process, sintering, solid and liquid temperatures. The Cu-substrate / metal powder interlayer / Cu-substrate sandwich samples were also investigated experimentally using DSC technique. This experiment simulates real soldering process using sandwich samples inside DSC. The microstructure and phase compositions of the samples obtained in consequence of different temperature/rate/atmosphere conditions inside DSC were investigated. The samples were investigated: microstructure, porosity, phase composition, diffusion profiles, etc. (SEM, WDX, TEM). The CALPHAD approach was used for the phase diagram calculations.

Název v anglickém jazyce

Interaction of Cu, Sn, and Ag nano-powders with Cu substrate

Popis výsledku anglicky

The contribution deals with nano-particles and raised from selected pure metals (Cu, Ag, Sn). The temperature behaviours of these powders under inert atmosphere and under reactive gas are studied as well as the particles / Cu substrate systems. The measurements of the thermal stability of the metal particles were obtained using DSC. It enables to evaluate heat effects of oxidation process, sintering, solid and liquid temperatures. The Cu-substrate / metal powder interlayer / Cu-substrate sandwich samples were also investigated experimentally using DSC technique. This experiment simulates real soldering process using sandwich samples inside DSC. The microstructure and phase compositions of the samples obtained in consequence of different temperature/rate/atmosphere conditions inside DSC were investigated. The samples were investigated: microstructure, porosity, phase composition, diffusion profiles, etc. (SEM, WDX, TEM). The CALPHAD approach was used for the phase diagram calculations.

Druh

O - Ostatní výsledky

CEP obor

CF - Fyzikální chemie a teoretická chemie

OECD FORD obor

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Projekt

<a href="/cs/project/GA106%2F09%2F0700" target="_blank" >GA106/09/0700: Termodynamika a mikrostruktura nanopráškových pájek šetrných k životnímu prostředí</a><br>

Návaznosti

P - Projekt vyzkumu a vyvoje financovany z verejnych zdroju (s odkazem do CEP)<br>S - Specificky vyzkum na vysokych skolach

Rok uplatnění

2009

Kód důvěrnosti údajů

S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů