Selective Cu electroplating enabled by surface patterning and enhanced conductivity of carbon fiber reinforced polymers upon air plasma etching
Identifikátory výsledku
Kód výsledku v IS VaVaI
<a href="https://www.isvavai.cz/riv?ss=detail&h=RIV%2F00216224%3A14310%2F24%3A00135889" target="_blank" >RIV/00216224:14310/24:00135889 - isvavai.cz</a>
Nalezeny alternativní kódy
RIV/62156489:43410/24:43925060
Výsledek na webu
<a href="https://www.sciencedirect.com/science/article/pii/S0925838824011563" target="_blank" >https://www.sciencedirect.com/science/article/pii/S0925838824011563</a>
DOI - Digital Object Identifier
<a href="http://dx.doi.org/10.1016/j.jallcom.2024.174569" target="_blank" >10.1016/j.jallcom.2024.174569</a>
Alternativní jazyky
Jazyk výsledku
angličtina
Název v původním jazyce
Selective Cu electroplating enabled by surface patterning and enhanced conductivity of carbon fiber reinforced polymers upon air plasma etching
Popis výsledku v původním jazyce
We demonstrate a sustainable post-processing of carbon fiber reinforced epoxy polymer (CFRP) composites by air plasma etching that permits regular electroconductive surface patterning through direct Cu galvanic metallization, in contrast to the untreated composite. Our study reveals a significant property dependence of the composite with respect to the position to the fiber/matrix composite surface and treatment. The enhancement in electrical conductivity was not compromised by the lower structural integrity of the composite, as the embedded carbon fibers remained unaffected by the air plasma etching process. The metallized Cu domains on the composite exhibit good hardness and excellent solderability potential. Thus, the electroconductive surface patterning of the composite, preceding galvanic metallization, facilitates the selective deposition of Cu layer domains. This step by step process, relying on the creation of selective electroconductive areas on the composite by plasma etching, enables galvanic metallization. Consequently, it enhances the potential for multifunctional composite applications. The feasibility of galvanic metallization brings new perspectives in selective metallization of composites by allowing the tailoring of the metal layer thickness, microstructure and selection of the metal.
Název v anglickém jazyce
Selective Cu electroplating enabled by surface patterning and enhanced conductivity of carbon fiber reinforced polymers upon air plasma etching
Popis výsledku anglicky
We demonstrate a sustainable post-processing of carbon fiber reinforced epoxy polymer (CFRP) composites by air plasma etching that permits regular electroconductive surface patterning through direct Cu galvanic metallization, in contrast to the untreated composite. Our study reveals a significant property dependence of the composite with respect to the position to the fiber/matrix composite surface and treatment. The enhancement in electrical conductivity was not compromised by the lower structural integrity of the composite, as the embedded carbon fibers remained unaffected by the air plasma etching process. The metallized Cu domains on the composite exhibit good hardness and excellent solderability potential. Thus, the electroconductive surface patterning of the composite, preceding galvanic metallization, facilitates the selective deposition of Cu layer domains. This step by step process, relying on the creation of selective electroconductive areas on the composite by plasma etching, enables galvanic metallization. Consequently, it enhances the potential for multifunctional composite applications. The feasibility of galvanic metallization brings new perspectives in selective metallization of composites by allowing the tailoring of the metal layer thickness, microstructure and selection of the metal.
Klasifikace
Druh
J<sub>imp</sub> - Článek v periodiku v databázi Web of Science
CEP obor
—
OECD FORD obor
10305 - Fluids and plasma physics (including surface physics)
Návaznosti výsledku
Projekt
—
Návaznosti
I - Institucionalni podpora na dlouhodoby koncepcni rozvoj vyzkumne organizace
Ostatní
Rok uplatnění
2024
Kód důvěrnosti údajů
S - Úplné a pravdivé údaje o projektu nepodléhají ochraně podle zvláštních právních předpisů
Údaje specifické pro druh výsledku
Název periodika
Journal of Alloys and Compounds
ISSN
0925-8388
e-ISSN
1873-4669
Svazek periodika
992
Číslo periodika v rámci svazku
July 2024
Stát vydavatele periodika
CH - Švýcarská konfederace
Počet stran výsledku
11
Strana od-do
1-11
Kód UT WoS článku
001235036500001
EID výsledku v databázi Scopus
2-s2.0-85191612894